Simple and Scalable Methodology for Equivalent Circuit Modeling of IC Packages

Mandic, Tvrtko; Nauwelaers, Bart; Barić, Adrijan

doi:10.1109/tcpmt.2013.2274820

Cited by 10 publications

(3 citation statements)

References 19 publications

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“…The amplitude A and the phase of -parameters are obtained based on the output parameters of the neural network, (6), and (7). The formula conversion block completes the transformation from the amplitude/phase to the real/imaginary parts of -parameters.…”

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confidence: 99%

“…Package modeling for active/passive devices have been a field of strong interest in recent years [5,6]. The equivalentcircuit-based model of metal-ceramic packages which was described in terms of inductances, resistances, and capacitances was used in radio frequency (RF) and microwave transistors [6,7]. When the equivalent-circuit parameters are simultaneously optimized by the device data, the exact relationship between the voltage and current of packaged transistor can be obtained.…”

Section: Introductionmentioning

confidence: 99%

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Neurospace Mapping Modeling for Packaged Transistors

Yan

Jin

Zhang

et al. 2018

Mathematical Problems in Engineering

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This paper presents a novel Neurospace Mapping (Neuro-SM) method for packaged transistor modeling. A new structure consisting of the input package module, the nonlinear module, the output package module, and the S-Matrix calculation module is proposed for the first time. The proposed method can develop the model only using the terminal signals, instead of the internal and physical structure information of the transistors. An advanced training method utilizing the different parameters to adjust the different characteristics of the packaged transistors is developed to make the proposed model match the device data efficiently and accurately. Measured data of radio frequency (RF) power laterally diffused metal-oxide semiconductor (LDMOS) transistor are used to verify the capability of the proposed Neuro-SM method. The results demonstrate that the novel Neuro-SM model is more accurate and efficient than existing device models.

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Section: = (mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Neurospace Mapping Modeling for Packaged Transistors

Yan

Jin

Zhang

et al. 2018

Mathematical Problems in Engineering

View full text Add to dashboard Cite

show abstract

“…Lots of labor work and development costs are needed to ascertain accurate relationships between manufacturing parameters and actual performance in semiconductor manufacturing [23,24]. Design and optimization of experiments (DOE) methods were widely utilized in both academia and industry to reduce experimental costs [25,26]. Shu firstly proposed a procedure using the DOE technique to form a pre-designed loop suitable for wire bond operation based on RSM [27].…”

Section: Introductionmentioning

confidence: 99%