Silver pattern transfer technique using concave region of mold and silver ink

Abstract

Previous studies have shown that the nano transfer printing (NTP) process can be realized in a cyclic olefin copolymer (COP) replica mold using a metal-oxide release layer. However, vacuum deposition of metals has the disadvantage of being time consuming. Therefore, there is a need for a technology to deposit metal films under atmospheric pressure. In this study, we performed two-tone transfers using silver ink. To achieve a two-tone transfer, it is necessary to separate the metal film from the top surface of the mold and the metal part at the bottom of the hole. However, in the case of silver ink, the hole is often completely filled; therefore, separation between the top surface and the bottom of the hole is difficult. To address this issue, we investigated the relationship between the spin-coating conditions and pattern success rate.

Transfer Durability of Re-release Coated Replica Mold on Ultraviolet Nanoimprint Lithography

“…UV-NIL is a nanoscale pattern-transfer process that uses a release-coated mold with nanoscale patterns and a UV-curable resin [5]. UV-NIL has recently been used not only to pattern resins but also to transfer silver ink and fabricate devices [6][7][8][9][10][11][12][13]. In UV-NIL, the patterned mold is directly contacted with the UV-curing resin, which causes resin adhesion, leading to the formation of defects in the mold [14][15].…”