Silver‐Palladium Thick‐Film Conductors

Abstract

The trends in integrated circuit packaging technology are toward high speed, high density, reliability, and low cost. These demand the improvement of material formulations and processing technology. Among the thick-film materials systems, conductor materials generally represent an important and the most expensive element. Therefore, attention has been centered on the performance of the fired metal film and its cost. Silver and palladium (Ag/Pd) conductors are important components of thick-film paste technology. Thick-film Ag/Pd conductors find applications in many aspects of electronics and electronic packaging, such as hybrid microcircuits, multichip modules, packaging for integrated microcircuits, and in passive electronic components such as multilayer capacitors, varistors, and inductors. In this paper, the performance and properties of fired Ag/Pd films are discussed through their physical and chemical aspects. The final film properties are correlated to a number of factors, including thermodynamics and kinetics of Pd oxidation during burnout and firing; chemical and physical reaction of the Ag/Pd with the ceramic substrate, organic vehicle, and solder; Ag diffusion and migration; B. B. Ghate-ontributing editor Manuscript No. 194446.

Direct‐Write Fabrication of Pb(Nb,Zr,Ti)O3 Devices: Influence of Paste Rheology on Print Morphology and Component Properties

“…14,16,17,21,22 Dimos et al 9,11 studied the relation between the rheological behavior and print properties of a series of commercially available thick film pastes patterned using a micropen apparatus. These studies showed that the commercially available thick film pastes exhibited shear thinning behavior with apparent viscosities of ϳ1 ϫ 10 5 cP in the printing range (␥ ϭ 20 -85 s Ϫ1 ); however, significant differences in their rheological behavior were observed in the low-shear (␥ Ͻ 1 s Ϫ1 ) or settling regime.…”

“…[7][8][9][11][12][13][14][15][16][17] Hence, commercially available screen printing pastes (e.g., silver-palladium conductor, ruthenium oxide resistor, and dielectric pastes) can be readily utilized in this direct-write approach. There is, however, a need to develop rheologically tailored, cofireable thick film pastes of functional ceramic materials (e.g., lead niobium zirconate titanate (PNZT), zinc oxide (ZnO), etc.).…”

Characterization of amorphous and crystalline silicon nanoclusters in ultra thin silica layers

“…Pd is mostly used for catalytic converters in auto mobiles [44], but can also be found in electronic devices such as computers, mobile phones, multi-layer ceramic capacitors, component plating, low voltage electrical contacts, and televisions [45]. The metal can also be used in dentistry [46], hydrogen purification, chemical applications, medicine, groundwater treatment, and fuel cells.…”

Review of Bi2O3based glasses for electronics and related applications

“…11,129,130 PbO in low melting frits and TF technology Thick film electronics makes wide use of glassy compounds, used as main components of overglazes, permanent binders for dielectrics and resistors, and also as frits/adhesion promoters for conductors. 21,22,24,59,[61][62][63][64][65] Note that the technology and materials are very similar for other applications such as architectural/automotive/ solar cell overglazes and conductors.For conductors, resistors and overglazes (and relatively old dielectrics), most classical low melting frits are based on the PbO-B 2 O 3 (lead borate) system, with mainly SiO 2 , ZnO and Al 2 O 3 additions. Several phase diagrams and property maps exist for these systems.…”