2014
DOI: 10.1063/1.4873127
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Silver antimony Ohmic contacts to moderately doped n-type germanium

Abstract: A self doping contact consisting of a silver/antimony alloy that produces an Ohmic contact to moderately doped n-type germanium (doped to a factor of four above the metal-insulator transition) has been investigated. An evaporation of a mixed alloy of Ag/Sb (99%/1%) onto n-Ge (ND=1×1018 cm−3) annealed at 400 °C produces an Ohmic contact with a measured specific contact resistivity of (1.1±0.2)×10−5 Ω-cm2. It is proposed that the Ohmic behaviour arises from an increased doping concentration at the Ge surface due… Show more

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Cited by 12 publications
(9 citation statements)
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“…NiGe alloys have demonstrated contact resistivities of 2 × 10 −7 Ω-cm 2 but only for contact n-type doping of 3 × 10 19 cm −3 . A better choice is Ag (1% Sb) which has demonstrated sufficiently low resistivity contacts even at n-Ge contact doping of 10 18 cm −3 [43]. The Ag is also ideal for plasmon waveguides at THz frequencies as explained above.…”
Section: Materials Choice and Thz Optical Datamentioning
confidence: 99%
See 1 more Smart Citation
“…NiGe alloys have demonstrated contact resistivities of 2 × 10 −7 Ω-cm 2 but only for contact n-type doping of 3 × 10 19 cm −3 . A better choice is Ag (1% Sb) which has demonstrated sufficiently low resistivity contacts even at n-Ge contact doping of 10 18 cm −3 [43]. The Ag is also ideal for plasmon waveguides at THz frequencies as explained above.…”
Section: Materials Choice and Thz Optical Datamentioning
confidence: 99%
“…First is Au to allow a direct comparison with many III-V THz QCLs [11]. Al and Cu are chosen as they are silicon foundry compatible and Ag is chosen as it provides the lowest losses in III-V THz QCLs [38] and also forms a good Ohmic contact to n-Ge [43]. The 300 K refractive index data used in the simulations for Al and Cu were taken from Ref.…”
Section: Materials Choice and Thz Optical Datamentioning
confidence: 99%
“…Photolithography was used before a mesa pattern was etched using SF 6 and C 4 F 8 mixed etch process (18) which has demonstrated very low levels of damage (19). Metal contacts were patterned using Ag (1% Sb) annealed at 400 ˚C at the top and bottom of the mesa to provide electrical Ohmic contacts (20). On top of the mesa a thin 50 nm Si 3 N 4 layer is deposited by PECVD before a four terminal thermometer was deposited using Ti/Pt metals.…”
Section: Methodsmentioning
confidence: 99%
“…First a mesa structure was patterned by photolithography and etched using a fluorine-based reactive ion etch process [17]. Next Ohmic contacts were produced at the top and bottom of the mesa using photolithography followed by deposition of Ag (1% Sb) [18] Two SR830 lock-in amplifiers were used to monitor the change in voltage in the Pd resistor, which was translated into a temperature after performing the calibration. The Seebeck voltage in open circuit was measured by probing the two contacts, whose terminals were connected to an external voltmeter.…”
Section: Device Fabrication and Characterizationmentioning
confidence: 99%