Silver(Ag) Improvements on The Structural, Creep Resistance and Electrical Conductivity Properties of Eutectic Sn-9Zn Alloys

Al-Salmi, M.S.N.; Ali, G.; Aljarbani, A.M.; Alsowidy, Shakib; Naji, Abdullah T.

doi:10.56807/buj.v2i3.116

Cited by 2 publications

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References 7 publications

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“…Secondly, all samples were polished using grades of silicon paper and then washed in a solution of (CH3COOH3), after that, the samples were drawn using the rolling mechanism technique; the first group was as wires of a diameter (D=1mm) and a length (L=70Cm) for Creep properties, Finally, the samples were washed again in a solution of (CH3COOH3) in order to remove residual stress and defects induced during specimen formation [12,13,14].…”

Section: Methodsmentioning

confidence: 99%

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Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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Research on Material Science has a long tradition, and lead has been used widely in many applications. Because of their low melting temperatures, low cost, and good wettability, tin -lead alloys have been preferred as solder alloys in industrial production, particularly in the electronics sector. However, due to the negative effects of lead on the environment and human health, studies on lead-free solder alloys have been increasing, and the subject is still important today. Furthermore, environmental protection agencies (RoHS and WEEE) have prohibited the use of lead-containing solder alloys in the manufacture of electronic and microelectronic products. In this work, the effect of adding Cu to alloys in five compositions of (81Sn-xCu-(19-x)In) % with x=1, 2, 3, 4, and 5 on the mechanical properties has been studied. The five samples were prepared from high purity (99%) elements (Sn –Cu –In ) using the melting technique. The creep of the ternary alloys was examined at different temperatures (25, 50, and 80 ) under three different loads (2.5, 6.3, and 11.4 MPa). It was found that the creep rate of the ternary alloys was increasing with the increases in Cu –content in all samples at different temperatures and loads. The mean values of the stress exponent were found to be in the range of (0.1-2.5) as well as the activation energies vaied in the range of (0.48-5.33) eV for all alloys under different loads (2.5, 6.3, and 11.4 MPa).

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Section: Methodsmentioning

confidence: 99%

“…The stress exponent (n) parameter and activation energy (Q) of the steady state creep were calculated using the relation [14,20]:…”

Section: Creep Stress Exponents and Activation Energy For (81sn -Xcu ...mentioning

confidence: 99%

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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Influence of Temperature on Creep Resistance, Structural and Electrical Characteristics of S9Z1 Eutectic Alloys

Ali,

Al-Salmi

2024

IJMSA

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In the present study, the structural and creep resistance properties of S9Z1 alloys with Cu-addition in concentrations (0.1 and 0.3% Wt.) have been investigated using x-ray diffractions (XRD) and Creep testing machine respectively. The three samples were prepared from high purity 99.99% by melting technique in the Pyrex tubs with CaCl2 to invaded the oxidation. The obtained samples were rolled drawn (cold rolling) into two groups. The first group was as wires for the creep resistance testing. The second group was as small sheets for structural investigations. Patterns of XRD showed that the S9Z1 alloy was primarily composed of two phases; a body centered tetragonal β-Sn matrix phase, and a secondary phase of hexagonal Zn. while with addition Cu (0.1 and 0.3% Wt.) to S9Z1 Alloys the results showed new peaks in the ternary compositions, such as Cu6Sn5, Cu5Zn8, phases respectively. The average of particle size (D) of β-Sn matrix was decreased with increasing Cu -adding, whereas the dislocation density (δ) increased with increasing addition. Creep properties of S9Z1, S9Z2 and 3 Alloys were examined at different temperatures (25, 40 and 80°C) under two constant loads (σ= 18.7 and 24.94 MPa). The creep behaviors of ternary alloys were higher than the S9Z1 alloys with all different temperatures under two constant loads. Also, the S9Z3 alloy with all different temperatures and two loads exhibited greatest creep resistance, due to the refinement structure and formation of new IMCs. Values of stress exponent (n) were found to be in the range of 1 to 10.55, for all S9Z2 and 3 alloys respectively. Values of activation energy (Q) of alloys were found to be in the range of 36.48 to 37.49 kJ/mol, for σ = 18.7 Mpa and 27 to 34.8 kJ/mol for σ = 24.94 Mpa for the S9Z1 alloys with Cu addition respectively. At room temperature (25°C), the electrical conductivity of the samples was calculated, and its values increased with Cu additions.

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Silver(Ag) Improvements on The Structural, Creep Resistance and Electrical Conductivity Properties of Eutectic Sn-9Zn Alloys

Cited by 2 publications

References 7 publications

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Influence of Temperature on Creep Resistance, Structural and Electrical Characteristics of S9Z1 Eutectic Alloys

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