2018
DOI: 10.1364/oe.26.033180
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Silicon slot fin waveguide on bonded double-SOI for a low-power accumulation modulator fabricated by an anisotropic wet etching technique

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Cited by 7 publications
(12 citation statements)
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“…Figure 1B shows the left and right fins are maximally misaligned along the z-axis and (Bi,Bii) show the cut through of lines i-i ′ /ii-ii ′ in (B), showing the periodically repeating left (Bi) and right (Bii) waveguide structure. The m = 0 design (Figure 1A) has already been presented and experimentally demonstrated [41]. The focus on this work is the mismatched fin-waveguide (m = 0).…”
Section: Design and Simulationmentioning
confidence: 99%
See 2 more Smart Citations
“…Figure 1B shows the left and right fins are maximally misaligned along the z-axis and (Bi,Bii) show the cut through of lines i-i ′ /ii-ii ′ in (B), showing the periodically repeating left (Bi) and right (Bii) waveguide structure. The m = 0 design (Figure 1A) has already been presented and experimentally demonstrated [41]. The focus on this work is the mismatched fin-waveguide (m = 0).…”
Section: Design and Simulationmentioning
confidence: 99%
“…Fabrication of the double-SOI platform and subsequent finwaveguide structure has been detailed elsewhere [41] and is simply outlined here. Five nanometers thermal oxide was grown on the surface of two (110) crystal-orientation SOI wafers (SOI thickness = 100, 115 nm), which were bonded and thinned creating the double-SOI substrate.…”
Section: Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…5 (i), which is asymmetric against the flip-flop exchange between left and right fin arrays. This asymmetry was useful to allow novel patterning of a double SOI bonded wafer 43) to pattern the bottom layer from the top, as shown in Figs. 6 (c), (g), and (k).…”
Section: Novel Si Photonic Waveguidesmentioning
confidence: 99%
“…First, we have manually bonded two (110) SOI wafers with ∼ 10-nm-thick thermal oxide face-to-face without any patterning. 43) In wafer bonding, it is important to avoid any particle contaminations, which prevents sufficient adhesion between layers, such that it was ideal to bond before patterning. Then, the challenge was to pattern the bottom SOI layer from the standard top-down lithography technique.…”
Section: Novel Si Photonic Waveguidesmentioning
confidence: 99%