Silicon sensor developments for the CMS Tracker upgrade

Dierlamm, A.

doi:10.1088/1748-0221/7/01/c01110

Cited by 19 publications

(26 citation statements)

References 8 publications

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“…The radiation environment for the silicon sensors will be a factor of about six higher than the design goal for the currently operated sensors. Therefore the collaborations have been investigating silicon materials and technologies to find more radiation tolerant solutions [6,7,8]. The main outcome was that electron read-out is superior to hole read-out, which is the read-out mode for p-in-n sensors used in the current tracking detectors.…”

Section: Introductionmentioning

confidence: 99%

Planar sensors for future Vertex and Tracking Detectors

Dierlamm¹

2014

Proceedings of 22nd International Workshop on Vertex Detectors — PoS(Vertex2013)

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With increasing instantaneous and integrated luminosities of collision experiments the requirements on position sensitive detectors and sensor materials increase rapidly. Numerous R&D projects of several collaborations have investigated known and new materials with respect to their range of application. This report gives an overview of the current activities and common understanding of planar sensors concentrating on operational aspects.

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Section: Introductionmentioning

confidence: 99%

Planar sensors for future Vertex and Tracking Detectors

Dierlamm¹

2014

Proceedings of 22nd International Workshop on Vertex Detectors — PoS(Vertex2013)

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“…In order to find a suitable silicon base material for the upcoming HL-LHC upgrade of the CMS Tracker, the CMS collaboration started a large campaign to investigate the properties of thin, single sided silicon sensors [4]. 164 wafers carrying several different designs have been produced by Hamamatsu Photonics K.K.…”

Section: Cms Tracker Campaignmentioning

confidence: 99%

“…The pixel sensors were diced out from the wafers without any further processing (no under bump metallization or deposition of bumps) since the wafers contained several other structures (strips, test structures, etc.) which were used for Tracker campaign [4]. The electrical characterization (I-V and C-V measurements) of HPK pixel sensors was performed in the laboratory at room temperature.…”

Section: Electrical Characterization 21 IV and Cv Measurementsmentioning

confidence: 99%

Laboratory and testbeam results for thin and epitaxial planar sensors for HL-LHC

et al. 2015

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The High-Luminosity LHC (HL-LHC) upgrade of the CMS pixel detector will require the development of novel pixel sensors which can withstand the increase in instantaneous luminosity to L = 5 × 10 34 cm −2 s −1 and collect ∼ 3000fb −1 of data. The innermost layer of the pixel detector will be exposed to doses of about 10 16 n eq /cm 2. Hence, new pixel sensors with improved radiation hardness need to be investigated. A variety of silicon materials (Float-zone, Magnetic Czochralski and Epitaxially grown silicon), with thicknesses from 50 µm to 320 µm in p-and n-type substrates have been fabricated using single-sided processing. The effect of reducing the sensor active thickness to improve radiation hardness by using various techniques (deep diffusion, wafer thinning, or growing epitaxial silicon on a handle wafer) have been studied. The results for electrical characterization, charge collection efficiency, and position resolution of various n-in-p pixel sensors with different substrates and different pixel geometries (different bias dot gaps and pixel implant sizes) will be presented.

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“…The standard baby sensors are produced by converting the about 80 µm pitch of the strips to about 45 µm pitch of the read-out chip pads [4]. These mini-strip sensors are used to evaluate radiation hardness of the different materials.…”

Section: The Wafer and Materialsmentioning

confidence: 99%

Sensor R&D for the CMS outer tracker upgrade for the HL-LHC

Behnamian

2014

J. Inst.

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At an instantaneous luminosity of 5 × 10 34 cm −2 s −1 , the high-luminosity phase of the Large Hadron Collider (HL-LHC) is expected to deliver a total of 3000 fb −1 of collisions, hereby increasing the discovery potential of the LHC experiments significantly. However, the radiation environment of the tracking system will be severe, requiring new radiation hard sensors for the CMS tracker. The CMS tracker collaboration has almost completed a large material investigation and irradiation campaign to identify the silicon material and design that fulfills all requirements of a new tracking detector at HL-LHC. Focusing on the upgrade of the outer tracker region, pad diodes as well as fully functional strip sensors have been implemented on silicon wafers with different material properties and thicknesses. The samples were irradiated with a mixture of neutrons and protons corresponding to fluences as expected for various positions in the future tracker. The measurements performed on the structures include electrical sensor characterization, measurements of the collected charge and bulk defect characterization. In this paper, the performance and limitations of the different materials are presented.

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Silicon sensor developments for the CMS Tracker upgrade

Cited by 19 publications

References 8 publications

Planar sensors for future Vertex and Tracking Detectors

Planar sensors for future Vertex and Tracking Detectors

Laboratory and testbeam results for thin and epitaxial planar sensors for HL-LHC

Sensor R&D for the CMS outer tracker upgrade for the HL-LHC

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