Optical Interconnects XVII 2017
DOI: 10.1117/12.2255719
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Silicon photonic transceivers for beyond 1-Tb/s datacom applications (Conference Presentation)

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“…Copackaged optical assembly: (a) schematic view of copackaged optical module comprising an ASIC (blue) and transceiver chiplets (red) on common carrier (grey) mounted on PCB (green) of a host card [31], (b) optical fiber connections from the copackaged optical module to (c) passive optical connector at front face-plate and/or backplane/midplane interface, (d) example of transceiver chiplet (courtesy of AIO Core Ltd.) [31,32], (e) 1st generation silicon photonics transceiver from H2020 COSMICC, (f) 2nd generation of silicon photonics transceiver from H2020 COSMICC project [33], (g) projected timeline for data center switch ASICs with increasing aggregate bandwidths.…”
Section: Figure 16mentioning
confidence: 99%
“…Copackaged optical assembly: (a) schematic view of copackaged optical module comprising an ASIC (blue) and transceiver chiplets (red) on common carrier (grey) mounted on PCB (green) of a host card [31], (b) optical fiber connections from the copackaged optical module to (c) passive optical connector at front face-plate and/or backplane/midplane interface, (d) example of transceiver chiplet (courtesy of AIO Core Ltd.) [31,32], (e) 1st generation silicon photonics transceiver from H2020 COSMICC, (f) 2nd generation of silicon photonics transceiver from H2020 COSMICC project [33], (g) projected timeline for data center switch ASICs with increasing aggregate bandwidths.…”
Section: Figure 16mentioning
confidence: 99%