“…[28][29][30][31][32] Metal-oxide, fluoride, and polymerbased DF-CSCs are easy to deposit at an acceptable cost (e.g., thermal evaporation, spin coating, or atomic layer deposition, ALD); however, most of them suffer from a poor stability, either chemically or thermally, [11,16,18,23,24,33] which limits their industrial applications. When the metal is in direct contact with the silicon surfaces, very large densities of electronic states at the interface can be introduced into 8-hydroxyquinolinolato-lithium (Liq), perylene diimide, have also been developed.…”