“…Furthermore, in applications involving prolonged exposure to an elevated temperature, such as a HAMR magnetic head, oxidation, delamination, sp 3 → sp 2 rehybridization (graphitization), and carbon diffusion into the substrate may compromise the reliability of the data storage device. Accordingly, an underlayer can be extremely beneficial not only for preventing carbon diffusion, especially if the intermixing layer of the a -C film cannot fulfil the role of a diffusion barrier, but also for acting as an adhesive and anti-corrosion layer that can effectively bond the a -C film to the substrate and prevent corrosion on the metallic substrate 26 , 33 – 35 . However, none of the former studies investigated the thermal stability and, particularly, the diffusion characteristics of a -C films in the presence of an adhesion underlayer under conditions of prolonged heating.…”