1990
DOI: 10.1149/1.2087093
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Silicon Dioxide Deposition by Atmospheric Pressure and Low‐Temperature CVD Using TEOS and Ozone

Abstract: portunity to make investigations with the STM, and to Dipl.-Phys. S. Br~uer for his help in recording the STM images and for helpful discussions about the results. We also thank the Stiftung Volkswagenwerk for financial support.

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Cited by 133 publications
(65 citation statements)
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“…The hotplate bake prior to diffusion serves to drive off the ethanol solvent leaving a glassy film of P205, H2O and TEOS. At diffusion temperatures above about 700 "C, TEOS reacts to form SiO2, H20 and CZH4 [6,7]. It is well known that P205 is extremely hygroscopic [a], and will react with H20 intentionally added to the SOD film, as well as with humidity in the laboratory environment and trace amounts of moisture in the process gasses, to form the volatile species H3P04 (phosphoric acid), which has a boiling point of about 400 "C. It is assumed that this is the phosphorus containing species that is transported from the source to the sample wafer.…”
Section: Ill-c Proposed Model For Doss Diffusionmentioning
confidence: 99%
“…The hotplate bake prior to diffusion serves to drive off the ethanol solvent leaving a glassy film of P205, H2O and TEOS. At diffusion temperatures above about 700 "C, TEOS reacts to form SiO2, H20 and CZH4 [6,7]. It is well known that P205 is extremely hygroscopic [a], and will react with H20 intentionally added to the SOD film, as well as with humidity in the laboratory environment and trace amounts of moisture in the process gasses, to form the volatile species H3P04 (phosphoric acid), which has a boiling point of about 400 "C. It is assumed that this is the phosphorus containing species that is transported from the source to the sample wafer.…”
Section: Ill-c Proposed Model For Doss Diffusionmentioning
confidence: 99%
“…As a result, BSF formation can be accomplished very quickly (within seconds or minutes) and at moderate temperatures (<900"C). This provides a distinct advantage over, for example, a deep p+ boron BSF that requires a lengthy (= 1 hour), hightemperature (= 1000"C) difision step in order to achieve low S.fl [9,10].…”
Section: Treatmentmentioning
confidence: 99%
“…The hotplate bake prior to diffhsion serves to drive off the ethanol solvent leaving a glassy phosphosilicate film (PSG). As temperatures are increased toward the target difision temperature (900-1000 "C), the PSG film polymerizes to form Si02, H20 and C2N [9,10]. It is well known that P205 is extremely hydroscopic, and will react with H20 in the SOD film, as well as with trace amounts of moisture in the process gasses, to form the volatile species HsP04 @hosphoric acid), which is weakly bonded to the PSG structure.…”
Section: Proposed Modelmentioning
confidence: 99%
“…The alkoxysilane are usually used are tetramethoxysilane Si(OMe) 4 , more usually know as TMOS and tetraethoxysilane, Si(OEt) 4 , known as TEOS. Both compounds have become a notorious chemical precursor in two important and widely used applications: (a) the preparation of inorganic materials by sol-gel methods [1], and (b) the formation of SiO 2 , films deposited by chemical vapor deposition [2].…”
Section: Introductionmentioning
confidence: 99%
“…Both compounds have become a notorious chemical precursor in two important and widely used applications: (a) the preparation of inorganic materials by sol-gel methods [1], and (b) the formation of SiO 2 , films deposited by chemical vapor deposition [2]. The application TEOS is more familiar used to study and observation due to less reactive than TMOS and recent experiments have explored used of TEOS to plasma enhanced chemical vapor deposition processes [3,4]. This research has studied about effect of organic motif on microstructure and birefringence phenomena's, in the matrices of ceramics formed via sol-gel processing.…”
Section: Introductionmentioning
confidence: 99%