2001
DOI: 10.1063/1.1358851
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Silicon carbide and silicon carbide:germanium heterostructure bipolar transistors

Abstract: In this letter, we report on heterostructure bipolar transistors ͑HBTs͒ based on silicon carbide ͑SiC͒ and a silicon carbide:germanium ͑SiC:Ge͒ alloy. The SiC:Ge base alloy was formed by the ion implantation of Ge into p-type 4H-SiC and subsequent annealing. HBT mesa structures were fabricated using a reactive ion etching process. The incorporation of Ge was found to increase the gain and the Early voltage of the devices. A common-emitter current gain ͑␤͒ of greater than 3 was measured for the SiC:Ge HBTs. Hom… Show more

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Cited by 39 publications
(25 citation statements)
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(4 reference statements)
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“…SiC doped with a few percent of Ge by ion implantation technique showed a reduction of the forward voltage drop and built-in voltage. 4 Heterostructure bipolar transistors (HBTs) produced with Ge-incorporated SiC showed an increase in gain with common-emitter current gain (b) of greater than 3 compared to homojunction SiC transistors with b of 2.2; and increase in early voltage and high breakdown voltages were also exhibited by the SiC-Ge devices. 4 A US patent 5 described a Ge-SiC layer as a floating gate material in Electrically Erasable Programmable Read-Only Memory (EEPROM) and flash memory devices which resulted in increased tunneling currents and faster erase operations.…”
Section: Introductionmentioning
confidence: 97%
“…SiC doped with a few percent of Ge by ion implantation technique showed a reduction of the forward voltage drop and built-in voltage. 4 Heterostructure bipolar transistors (HBTs) produced with Ge-incorporated SiC showed an increase in gain with common-emitter current gain (b) of greater than 3 compared to homojunction SiC transistors with b of 2.2; and increase in early voltage and high breakdown voltages were also exhibited by the SiC-Ge devices. 4 A US patent 5 described a Ge-SiC layer as a floating gate material in Electrically Erasable Programmable Read-Only Memory (EEPROM) and flash memory devices which resulted in increased tunneling currents and faster erase operations.…”
Section: Introductionmentioning
confidence: 97%
“…Only SiCGe alloy formed by ion implantation of Ge into a p-type 4H-SiC has been reported. [5,6] However, they did not investigate the microstructural properties of the SiCGe films on SiC. Moreover, SiCGe thin films grown by LPCVD have a higher Ge content and a variable C/Si ratio, which are different from the SiCGe films formed by ion implantations.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore nonequilibrium methods of material synthesis must be chosen to form the required composition. Such methods are (1) ion beam synthesis [3,8,9], (2) plasma assisted deposition and (3) MBE at low temperatures [10]. In the present study our effort was to obtain Ge incorporation into the 3C-SiC lattice by using solid source molecular beam epitaxial (SSMBE) growth on Si substrates in order to create a cubic SiC:Ge alloy.…”
Section: Introductionmentioning
confidence: 99%