Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion

Lee, Sung-Bum; Lee, Ho Sik; Son, Chang Bum; Kim, Sung Hee; Lee, Jun Young

doi:10.1007/s13233-020-8135-8

Cited by 6 publications

(1 citation statement)

References 9 publications

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“…They have excellent thermal/mechanical properties, 5–7 numerical stability, 8 chemical resistance, 9–11 solvent resistance at high temperatures, 12 and are employed in a variety of applications due to their excellent physical characteristics 13–18 . Due to their low shrinkage curability 19,20 and outstanding water/weather resistance, they are also employed as promising materials in a number of areas such as adhesives, 21–24 electronic laminates, 25,26 coatings, 27–30 and high performance composites 31–37 . However, once cured, thermosetting polymers do not melt or flow even when reheated, and thermal decomposition accelerates with repeated heating, making it difficult to not only reprocess but also recycle the material 38 .…”

Section: Introductionmentioning

confidence: 99%

Malleable and recyclable thermoset network with reversible β‐hydroxyl esters and disulfide bonds

Lee

Nanthananon

Kim

et al. 2022

J of Applied Polymer Sci

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By combining bifunctional diglycidyl ether of bisphenol A (DGEBA) and trifunctional tris(4-hydroxyphenyl) methane triglycidyl ether (TMTE) epoxy monomers, along with 4,4 0 -dithiodibutyric acid (DTDBA) as a carboxylic acid, a variety of novel reprocessable and recyclable thermoset polymers are synthesized. The crosslinked network structures with different crosslinking densities are produced by changing the mixing ratio between DGEBA and TMTE, resulting in changes in mechanical and thermal properties of the final products. The stress relaxation and self-healing experiments confirmed that all of these polymeric materials have covalent adaptable networks in their microstructures and perform reversible transesterification processes inside a polymer network. These thermoset polymers are completely decomposed in solution by disulfide-thiol reduction of DTDBA with reversible cleavage or coupling capability in the presence of reducing agent, allowing chemical recycling capability into the thermoset polymer network.

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