Climate change is occurring at a much faster rate than in the past and it cannot be explained solely by natural causes. Humans, specifically the greenhouse gases (GHG) emissions produced by human activity, are the primary cause of the earth’s rapidly changing climate today. As one of the most GHG emission industries, semiconductor, at present, there is no clear guideline for the implementation of significant reduction method for many fluorinated compounds (FCs), N2O and NF3 greenhouse gases in the domestic and overseas semiconductor industry. Therefore, this report, implementation principles of optimal control technology for the GHG emissions have been proposed based on the Intergovernmental Panel on Climate Change (IPCC) and old reduction method. This reduction method is suitable for the installation of efficient exhaust gas destruction equipment for the removal of FCs and N2O from Etching, Thin Film, including chemical/physical vapour deposition, and Diffusion processes in the semiconductor industry.