Signaling analysis of inter-chip I/O package routing for Multi-Chip Package

Yong, Khang Choong; Song, Wil Choon; Cheah, Bok Eng; Ain, Mohd Fadzil

doi:10.1109/acqed.2012.6320509

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Signaling analysis of inter-chip I/O package routing for Multi-Chip Package

Cited by 4 publications

References 6 publications

Evaluation of wireless network-on-chip architectures with microchannel-based cooling in 3D multicore chips

Evaluation of wireless network-on-chip architectures with microchannel-based cooling in 3D multicore chips

Signaling scheme for high speed die-to-die interconnection in multi-chip package (MCP) technology

Capacitive crosstalk compensation structure for improved high-speed on-package signaling

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