Signal transmission loss on printed circuit board in GHz frequency region

Okubo, Takuya; Sudô, Toshio; Hosoi, T.; Tsuyoshi, Hiroaki; Kuwako, Fujio

doi:10.1109/edaps.2013.6724402

Cited by 16 publications

(10 citation statements)

References 2 publications

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“…Copper (Cu) electroplating is a technique used for the metallisation of printed circuit board (PCB) surfaces to allow individual layers to be electrically interconnected. The technological growth of high-value PCBs is currently driven by the development of boards, which can propagate high frequency signals above 1 GHz (Okubo et al , 2013) with transmission speeds over 25 Gb/s (Muller et al , 2015) and at low bit error rates. Additionally, small track feature sizes are desired to allow for large board component densities.…”

Section: Introductionmentioning

confidence: 99%

“…A metal surface roughness of size of 0.3 mm (Trelleborg, 2008) is efficient for manufacturing, as it enables adhesion of dry film resist and surface finish plating such as electrolytic silver. For high frequency (≥1 GHz) applications, a large surface roughness in the PCB manufacture would be undesirable, as electrical signals transmitted through surface Cu features undergo increased bit error rates for surface roughness increases (Okubo et al , 2013).…”

Section: Introductionmentioning

confidence: 99%

“…increasing performance requirements within the PCB industry, such as larger aspect ratio, driven by a demand for a higher number of electronic components and stacking densities of PCB layer. The technological growth of high-value PCBs is currently driven by the development of boards which can propagate high frequency signals above 1 GHz (Okubo et al, 2013) with transmission speeds over 25 Gb/s (Muller et al, 2015) and at low bit error rates. Additionally, small track feature sizes are desired to allow for large board component densities.…”

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confidence: 99%

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Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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Purpose ± A study of the influence of megasonic (MS) assisted agitation on Printed Circuit Boards (PCBs) electroplated using copper electrolyte solutions, to improve plating efficiencies through enhanced ion transportation. Design/methodology/approach-The impact of MS assisted agitation on topographical properties of the electroplated surfaces studied, through a Design of Experiments (DOE), by measuring surface roughness, characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high resolution scanning electron microscopy. Findings ± An increase of Ra from 400 nm to 760 nm measured after plating, for an increase to acoustic power from 45 W to 450 W. Roughening increase due to micro-bubble cavitation energy, supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low-currents, leading to large Cu grain frosting reducing the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, also observed reducing the uniformity of the deposit. Research limitations/implications ± The formation of unstable transient cavitation and variation of the topology of the copper surface are unwanted phenomena. Further plating studies using megasonic agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented. Practical implications ± Identify manufacturing settings required for high-quality MS assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique. Originality/value ± Quantification of the topographical changes to a PCB surface in response to megasonic agitation and evidence for deposited copper artefacts due to acoustic effects.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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confidence: 99%

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Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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“…The homogeneity, thickness, and roughness of the layers do influence the signal transmission loss and, in this case, the UWB antenna’s reflection coefficient [ 69 , 70 , 71 ]. The results presented in this paper proved the effect of these parameters on the antenna behavior.…”

Section: Resultsmentioning

confidence: 99%

Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate

et al. 2022

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The design, simulation, realization, and measurement of an ultra-wideband (UWB) antenna on a polymeric substrate have been realized. The UWB antenna was prepared using conventional technology, such as copper etching; inkjet printing, which is regarded as a modern and progressive nano-technology; and polymer thick-film technology in the context of screen-printing technology. The thick-film technology-based UWB antenna has a bandwidth of 3.8 GHz, with a central frequency of 9 GHz, and a frequency range of 6.6 to 10.4 GHz. In addition to a comparison of the technologies described, the results show that the mesh of the screens has a significant impact on the quality of the UWB antenna when utilizing polymeric screen-printing pastes. Last but not least, the eco-friendly combination of polyimide substrate and graphene-based screen-printing paste is thoroughly detailed. From 5 to 9.42 GHz, the graphene-based UWB antenna achieved a bandwidth of 4.42 GHz. The designed and realized UWB antenna well exceeds the Federal Communications Commission’s (FCC) standards for UWB antenna definition. The modification of the energy surface of the polyimide substrate by plasma treatment is also explained in this paper, in addition to the many types of screen-printing pastes and technologies. According to the findings, plasma treatment improved the bandwidth of UWB antennas to 5.45 GHz, and the combination of plasma treatment with graphene provides a suitable replacement for traditional etching technologies. The characteristics of graphene-based pastes can also be altered by plasma treatment in terms of their usability on flexible substrates.

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“…The high surface profile (i.e., high surface roughness) copper foils are of-ten used for high bonding strength between the copper foil with resin of a PCB, whereas the low surface profile (i.e., low surface roughness) copper foils are used to minimize the signal loss in conductor (i.e., skin effect) 21,22,33,34 for high-frequency transmission application. The Cl − -contained formula without an accelerator was suitable for fabricating the high bonding strength copper foil, whereas the Cl − + PEG + accelerator formula was suitable for fabricating the high-frequency transmission copper foil.…”

Section: Resultsmentioning

confidence: 99%

Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness

Chan

Ren

Wen

et al. 2017

J. Electrochem. Soc.

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This study focuses on the effects of plating additives and forced convection on microstructure and surface roughness of a copper foil at high current densities. A pilot Cu plating bath was designed according to the simulation of flow field using COMSOL Multiphysics. Accordingly, accurate fluid flow rates and the streamline patterns thereof were obtained in this work. The surface roughness of copper deposit depended on the limiting current density of cupric ions, the distribution of adsorbed chloride ions and the adsorbed organic additives at high current densities (10∼60 A·dm−2). Forced convection has strong influence on these factors as mentioned above. A copper foil with low surface roughness could be consequently obtained for the application of high frequency transmission in printed circuit board industry.

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Signal transmission loss on printed circuit board in GHz frequency region

Cited by 16 publications

References 2 publications

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate

Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness

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