Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory

Hong, Jonghyun; Yoon, Jiwon; Kim, Hyunwoo; Son, Keeyoung; Choi, Seonguk; Lee, Junghyun; Kim, Keunwoo; Park, Joonsang; Kim, Seongguk; Sim, Boogyo; Kim, Joungho

doi:10.1109/epeps58208.2023.10314922

2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2023

DOI: 10.1109/epeps58208.2023.10314922

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Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory

Jonghyun Hong,

Jiwon Yoon,

Hyunwoo Kim

et al.

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Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory

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