Signal Integrity and Radiated Emission of High‐Speed Digital Systems

Caniggia, S.; Maradei, F.

doi:10.1002/9780470772874

Cited by 61 publications

(27 citation statements)

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“…This equation is valid with an error less of 1% up to the frequencies near the first series resonant frequency of the PCB caused by the inductance associated with the connection of the test ports and the board capacitance [2], [4]. Ideally, in point1 of a PCB where the IC switches, S 11 should be maximized in order to have a very low Z 11 (i.e., Z PDN ) in the frequency range of interest.…”

Section: Z Pdn Versus Scattering Parametersmentioning

confidence: 99%

“…Under the assumption that the field perturbation due to the switching device travels outwards from the component with cylindrical symmetry, the generated waves move as in a radial transmission line which behaves as a non-uniform TL with line inductance and capacitance depending on the radial distance r from the origin [2], [13], [14]. In that case, the board radial inductance L board can be calculated by the radial transmission line theory as:…”

Section: Low-frequency Spice Model For Decoupling Capacitor Investigamentioning

confidence: 99%

“…The main drawback of this approach is the long computational time required, and it doesn't allow fast investigation of physical phenomena causing EMI. For this purpose, it is convenient to use other approaches such as the cavity model [2], [4] which is very suitable for modeling parallel solid planes with and without decoupling capacitors, or SPICE circuit modeling that allows a fast investigation of EMI phenomena involved [2].…”

Section: Pdn Investigation By a Full-wave Software Toolmentioning

confidence: 99%

“…The main purpose of the board-level PDN is to distribute stable power from the voltage module regulator (VMR) to the electronics. However, switching circuitry demands static and dynamic current, which across the PDN impedance Z PDN causes the voltage to fluctuate at the chip's power-supply terminals [2]. The noise circulating into power and ground planes can affect the operation of other active devices (signal/power integrity), as well as producing radiation (EMI).…”

Section: Introductionmentioning

confidence: 99%

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Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

Maradei

Caniggia²,

Inverardi³

et al. 2010

IEICE Trans. Commun.

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Francescaromana MARADEI†a) , Spartaco CANIGGIA † †b) , Nicola INVERARDI † † †c) , and Mario ROTIGNI † † † †d) , Nonmembers SUMMARY This paper provides an investigation of power distribution network (PDN) performance by a full-wave prediction tool and by experimental measurements. A set of six real boards characterized by increasing complexity is considered in order to establish a solid base for behaviour understanding of printed circuit boards. How the growing complexity impacts on the board performance is investigated by measurements and by simulations. Strengths and weakness of PDN modeling by the full-wave software tool Microwave Studio are highlighted and discussed.

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Section: Z Pdn Versus Scattering Parametersmentioning

confidence: 99%

Section: Low-frequency Spice Model For Decoupling Capacitor Investigamentioning

confidence: 99%

Section: Pdn Investigation By a Full-wave Software Toolmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

Maradei

Caniggia²,

Inverardi³

et al. 2010

IEICE Trans. Commun.

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“…The partial inductance of a ground plane is a parameter which indirectly determines the level of CM radiation [5]. Due to this inductance, there is a voltage drop which provides a noise source that can drive common mode current on the external structure.…”

Section: Rd International Conference On Electric and Electronics (Eementioning

confidence: 99%

Evaluation of the Radiated Emission of a Printed Circuit Board Attached with Cables

Sayegh¹,

Jenu

2013

Proceedings of the 3rd International Conference on Electric and Electronics

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Abstract-An electronic product has to comply with a myriad of EMC requirements before it can be marketed globally. Radiated Emission is one of the EMC requirements which constantly poses a challenge to many circuit designer due to the ever increasing speed of PCB clocks. Consequently, in the product it is essential to investigate, identify, model and predict the PCB radiated emission before compliance test is performed for cost and time saving. In this paper, a simple double layer PCB board is fabricated to investigate the PCB radiated emission. Three PCB configurations are investigated for the level of emissions and to correlate with the common-mode currents. These configurations are PCB without attached cables, with one attached cable and with two attached cables. The radiated emission from each configuration is measured in a semi-anechoic chamber at open circuit and 50 ohm loads. It can be shown that the cables are the major sources of radiated emission due to the common-mode currents flowing through it.

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Grounding on Printed Circuit Boards (PCBs)

Joffe

Lock

2009

Grounds for Grounding

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Signal Integrity and Radiated Emission of High‐Speed Digital Systems

Cited by 61 publications

References 0 publications

Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

Evaluation of the Radiated Emission of a Printed Circuit Board Attached with Cables

Grounding on Printed Circuit Boards (PCBs)

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