Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging

Krishna, Ram; Watanabe, Atom O.; Golz, John W.; Bonam, Ravi; Libsch, Frank R.; Rosenbaum, Elyse; Kumar, Arvind

doi:10.1109/ectc51909.2023.00171

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023

DOI: 10.1109/ectc51909.2023.00171

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Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging

Ram Krishna,

Atom O. Watanabe,

John W. Golz

et al.

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Cited by 4 publications

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Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging

Sun,

Shi,

Nguyen

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging

Cited by 4 publications

References 12 publications

Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging

Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging

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