Signal and Power Integrity Co-Simulation of Chiplet-to-Chiplet Channel Based on Latency Insertion Method

Zhou, Yi; Shi, Bobi; Nguyen, Thong; Sun, Haofeng; Schutt-Ainé, José E.

doi:10.1109/spi60975.2024.10539220

2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) 2024

DOI: 10.1109/spi60975.2024.10539220

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Signal and Power Integrity Co-Simulation of Chiplet-to-Chiplet Channel Based on Latency Insertion Method

Yi Zhou,

Bobi Shi,

Thong Nguyen

et al.

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Signal and Power Integrity Co-Simulation of Chiplet-to-Chiplet Channel Based on Latency Insertion Method

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