2012
DOI: 10.1186/1556-276x-7-22
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SiC formation for a solar cell passivation layer using an RF magnetron co-sputtering system

Abstract: In this paper, we describe a method of amorphous silicon carbide film formation for a solar cell passivation layer. The film was deposited on p-type silicon (100) and glass substrates by an RF magnetron co-sputtering system using a Si target and a C target at a room-temperature condition. Several different SiC [Si1-xCx] film compositions were achieved by controlling the Si target power with a fixed C target power at 150 W. Then, structural, optical, and electrical properties of the Si1-xCx films were studied. … Show more

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Cited by 24 publications
(7 citation statements)
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“…CuSbSe 2 thin films were deposited on 1 × 1 cm 2 Corning glass substrates using an RF magnetron cosputtering system (IDT Engineering Co., Gyeonggi, Korea) [24][25][26][27], as shown in Figure S1, with CuSe 2 (TASCO, Seoul, Korea, 99.99% purity, 2-inch diameter) target under a fixed power of 40 W and variable power for Sb (TASCO, 99.99% purity, 2-inch diameter) target from 13 to 21 W in increments of 2 W, while other parameters were kept constant using the following conditions: presputtering process for 5 min prior to each run, an Ar gas flux of 20 sccm, base pressure of 1.0 × 10 −6 Torr, substrate-to-target distance of 5.0 cm, and vacuum pressure of 7.5 × 10 −3 Torr during sputtering at room temperature. During the target cleaning procedure, the substrates were shielded with a shutter.…”
Section: Methodsmentioning
confidence: 99%
“…CuSbSe 2 thin films were deposited on 1 × 1 cm 2 Corning glass substrates using an RF magnetron cosputtering system (IDT Engineering Co., Gyeonggi, Korea) [24][25][26][27], as shown in Figure S1, with CuSe 2 (TASCO, Seoul, Korea, 99.99% purity, 2-inch diameter) target under a fixed power of 40 W and variable power for Sb (TASCO, 99.99% purity, 2-inch diameter) target from 13 to 21 W in increments of 2 W, while other parameters were kept constant using the following conditions: presputtering process for 5 min prior to each run, an Ar gas flux of 20 sccm, base pressure of 1.0 × 10 −6 Torr, substrate-to-target distance of 5.0 cm, and vacuum pressure of 7.5 × 10 −3 Torr during sputtering at room temperature. During the target cleaning procedure, the substrates were shielded with a shutter.…”
Section: Methodsmentioning
confidence: 99%
“…This makes a-SiC thin films a potential candidate for applications in many kinds of optoelectronic devices with spectral tunability, such as tunable light-emitting diodes, image sensors, solar cells and wide spectral range photodetectors [17][18][19][20][21] The a-SiC thin films have been used as a protective coating for extreme UV optics due to its high reflectivity in this spectral region [22]. It can effectively be used as a thermally stable surface passivation material for highly efficient thin film silicon-based photovoltaic devices [23]. Furthermore, a-SiC films are chemically and mechanically stronger and more durable in terms of temperature resistance than a-Si films.…”
Section: Introductionmentioning
confidence: 99%
“…Кукушкин с соавторами [4,5,[8][9][10] достигли успехов в синтезе тонких эпитаксиальных пленок SiC на Si новым методом замещения атомов. Joung и соавторы [11] предложили метод осаждения аморфного a-Si 1−x C x с помощью радиочастотного магнетронного сораспыления двух или нескольких мишеней.…”
Section: Introductionunclassified