1996
DOI: 10.1016/0925-4005(96)01947-8
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Si-planar-pellistor: designs for temperature modulated operation

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Cited by 37 publications
(13 citation statements)
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“…State-of-the-art, low-power sensors for portable instrument applications employ filaments formed from 12.5 m (diameter) wire! Throughout the past decade, there has been an increasing number of reports of microfabrication (MEMS) techniques for preparation of catalytic detectors [21]- [30]. A typical approach is deposition of a Pt resistor (meander) onto a membrane material (SiN) followed by application of a catalytic layer similar to those described earlier in this section [29], [30].…”
Section: Design and Operation Considerationsmentioning
confidence: 99%
“…State-of-the-art, low-power sensors for portable instrument applications employ filaments formed from 12.5 m (diameter) wire! Throughout the past decade, there has been an increasing number of reports of microfabrication (MEMS) techniques for preparation of catalytic detectors [21]- [30]. A typical approach is deposition of a Pt resistor (meander) onto a membrane material (SiN) followed by application of a catalytic layer similar to those described earlier in this section [29], [30].…”
Section: Design and Operation Considerationsmentioning
confidence: 99%
“…CMOS-based sensor structures include surface-micromachined, free-standing, Pt-coated polysilicon micro-filaments separated from the substrate by an air gap [28,29] or micromachined membranes [30][31][32][33][34]. Heat losses to the silicon frame are minimized in both designs.…”
Section: Catalytic Thermal Sensors (Pellistors)mentioning
confidence: 99%
“…These are the fabrication steps: 1) bulk micromachining: backside etching (KOH) to achieve a membrane structure [65], [68], [69]; 2) surface micromachining: sacrificial layer etching (HF) for the bridges [66], [67]; 3) Pt or catalyst deposition: sputtering [70], evaporation [68], [69], and LPCVD [66], [67].…”
Section: B Thermal Sensorsmentioning
confidence: 99%