Shunting effect in explosive electron emission

Mesyats, G.; Parkevich, E. V.; Pikuz, S. A.; Yalandin, M. I.

doi:10.1134/s1028335816100037

Cited by 17 publications

(23 citation statements)

References 2 publications

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“…This discrete EDMP model is in a good agreement with the similar model of explosive electron emission (EEE) developed by Mesyats [2,3]. According to the EDMP model, the motive force of erosion, mass transfer, and portioning is the electron packet, and in the EEE model this role is assigned to the discrete electron avalanche named ecton.…”

Section: Discussionsupporting

confidence: 79%

“…When the contacts start approaching, the electric field starts to increase and reaches 10 5 -10 6 V·cm −1 at the distance of 0.1-1 µm. Moreover, on microirregularities (asperities), which usually exist on all surfaces, the electric field can increase up to 10 7 -10 8 V·cm −1 [2,3].…”

Section: Discussionmentioning

confidence: 99%

“…The surface erosion of magnetically operated hermetical contacts (reed switches or RS) [1] occurring under the commutation of electrical current is similar in many respects to the processes taking place in the course of explosive electron emission, arc and spark discharges [2,3], electrical discharge machining and doping [4,5], surface modification by pulse discharges [6][7][8][9], and high-intensity ion, plasma, and laser irradiation of materials [10,11]. There are currently no generally recognized models explaining these processes, since they occur under non-equilibrium conditions, in limited volumes, and during short time intervals.…”

Section: Introductionmentioning

confidence: 99%

“…Mesyats [2,3] has refined this by introducing the discrete electron avalanche (named ecton), which is born during the explosion of liquid metal bridges. Ecton can be regarded as the main motive force of mass transfer under breaking/shorting of the contacts.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Surface Erosion of Low-Current Reed Switches

Zeltser

Karpov²,

Моос

et al. 2017

Coatings

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Abstract:The erosion model of the surface coatings of reed switches considering different physicochemical processes occurring on the contact surfaces and inside the inter-electrode gap was proposed. According to that, the discrete electron avalanche (ecton) introduced in the explosive electron emission theory by Mesyats is considered as the main motive force responsible for the surface modification and mass transfer of materials in the course of breaking/shorting of the contacts. By means of SEM imaging and energy dispersive X-ray microanalysis of the contact surfaces after various numbers of switching cycles, the energy threshold of the ecton generation defining the erosion stability of the coatings was found to be proportional to the specific sublimation and ionization energies of coating materials. It has been shown that the total erosion of the coatings on the working surface of the contacts after the commutation test possess the resultant character; i.e., the specificities of erosion occurring after each commutation event are characteristic for the whole of the commutation test. In further development of our model, we suggested that a few monolayers of metals (or alloys) with low ionization potential deposited on the main coatings can improve the erosion stability of contacts.

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Section: Discussionsupporting

confidence: 79%

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Surface Erosion of Low-Current Reed Switches

Zeltser

Karpov²,

Моос

et al. 2017

Coatings

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“…Plasma formation is closely related to the electron emission mechanism, which is thermally unstable thermo-field emission [96,97], a locally concentrated, non-linear superposition of field emission [98,99] and thermionic emission [100]. This is also known as explosive emission [101], and the arc spot may be considered as a sequence of rapid microscopic explosions [92,102]. A concept for highly localized phase transition of the cathode material from solid to plasma is thermal runaway: the electron-emitting site usually starts where the electric surface field is very high, i.e.…”

Section: Cathodic Arc Plasma Production With Emphasis On Pulsed Arcsmentioning

confidence: 99%

A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS)

Anders

2014

Surface and Coatings Technology

234

109

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High power impulse magnetron sputtering (HiPIMS) has been in the center of attention over the last years as it is an emerging physical vapor deposition (PVD) technology that combines advantages of magnetron sputtering with various forms of energetic deposition of films such as ion plating and cathodic arc plasma deposition. It should not come at a surprise that many extension and variations of HiPIMS make use, intentionally or unintentionally, of previously discovered approaches to film processing such as substrate surface preparation by metal ion sputtering and phased biasing for film texture and stress control. Therefore, in this review, an overview is given on some historical developments and features of cathodic arc and HiPIMS plasmas, showing commonalities and differences. To limit the scope, emphasis is put on plasma properties, as opposed to surveying the vast literature on specific film materials and their properties.

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Laser Cladding of Layered Ti/Nb/Cu Cathode with Homogeneous Arc Ablation Behaviors

Guan

Gao

et al. 2023

Adv Eng Mater

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Arc ablation threatens the cathode operating time and restricts the development of high‐power arc heaters. Surface modification is an effective strategy in improving cathode ablation resistance without reducing matrix conductivities. Herein, Nb layer and Ti layer are laser clad on Cu matrix to decrease the arc ablation of Cu cathode. The total thickness of laser‐clad Nb/Ti layer reaches 1850 μm. The Nb layer restrains Cu from diluting into surface cladding and no detrimental Ti–Cu intermetallic is formed. The surface Ti content is as high as 98.34 at%, guaranteeing the arc discharge homogeneity. The arc ablation behaviors of Ti/Nb/Cu cathodes are investigated in air atmosphere. The layered cathode discharges and ablates homogeneously. The arc discharge center is shallow with no appearance of deep pits or craters. The maximum ablation depth (72.1 μm) after 30 s discharging is ≈33.4% lower than that of Cu cathode. Besides, the cathode ablation rate, 1.61 μg C−1, is ≈27.5% lower than Cu cathode. The improved arc ablation resistance is interpreted in the protective effect of refractory TiO2 layer formed during air arc discharging.

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Shunting effect in explosive electron emission

Cited by 17 publications

References 2 publications

Surface Erosion of Low-Current Reed Switches

Surface Erosion of Low-Current Reed Switches

A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS)

Laser Cladding of Layered Ti/Nb/Cu Cathode with Homogeneous Arc Ablation Behaviors

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