Atomistic mechanisms of strain relaxation due to ductile void growth in ultrathin films of face-centered-cubic metals Non-equilibrium molecular-dynamic simulations were carried out on model three-dimensional nano-void copper material with different idealised pore structure and porosity to highlight differences in response behaviour between them when subjected to various piston velocities simulating planar shock loading of different intensities. This article demonstrates and explains from a mechanistic perspective the differences in response observed with respect to Hugoniot elastic limits, dislocation line and jet formation, void collapse mechanism and hot spot generation, specific volume, partial recrystallisation and temperature evolution in void collapsed regions, shock and particle velocity curves. V C 2014 AIP Publishing LLC. [http://dx.