2012
DOI: 10.1007/s00397-012-0636-8
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Shear thickening of chemical mechanical polishing slurries under high shear

Abstract: Chemical mechanical polishing (CMP) is a fundamental technology used in the semiconductor manufacturing industry to polish and planarize electronic materials. During the high shear (≥1,000,000 s −1 ) polishing process, it is hypothesized that individual slurry particles begin to interact and collide with one another forming large agglomerates (≥0.5 μm). These agglomerates are suspected of causing defects such as scratches or gouges during polishing, which costs the semiconductor industry billions of dollars an… Show more

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Cited by 35 publications
(20 citation statements)
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References 40 publications
(59 reference statements)
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“…In recent years, the STFP method has been studied and applied in the polishing process of complicated products [24][25][26][27][28] . This machining method has been used in various industrial fields including human body armor 29 , smart structures, shock absorbing devices 30 , and fine polishing 31,32 . This indicates that the STFP offers high advantageous and efficiency in the manufacturing process.…”
Section: Modeling Of Stfp Process Stfp Processmentioning
confidence: 99%
“…In recent years, the STFP method has been studied and applied in the polishing process of complicated products [24][25][26][27][28] . This machining method has been used in various industrial fields including human body armor 29 , smart structures, shock absorbing devices 30 , and fine polishing 31,32 . This indicates that the STFP offers high advantageous and efficiency in the manufacturing process.…”
Section: Modeling Of Stfp Process Stfp Processmentioning
confidence: 99%
“…A number of recent studies have used the above mentioned adaptations and gap error corrections of parallel-plate setups with micrometer gap separations with a focus on studying fluids a high shear rates [23,24,46,60,75], and on confinement effects [23,24,46,89,95]. In addition, these setups have been used to study small sample volumes [60], and to mimic usage or processing environment conditions [23,46,89].…”
Section: Adaptations To a Conventional Rotational Rheometermentioning
confidence: 99%
“…Figure 1 gives an example of a flow curve obtained from a sample volume of only 0.3 nL. Furthermore, decreasing the length scale over which a sample is probed allows to attain high shear rates [16] that are encountered in many industrial processes (e.g.γ ≥ 10 6 s −1 as reported in [23]).…”
Section: Introductionmentioning
confidence: 99%
“…While regular gap settings on the order of a millimeter are most of the time sufficient, lower gap separations can be desirable. This might be the case if only small sample volumes are available [2][3][4][5][6][7][8], when slip needs to be determined via a Mooney analysis (since measurements at small gap settings lead to a higher resolution for the determination of slip velocities) [9][10][11][12][13][14], for measurements at higher rates for a given (maximum) velocity difference of the shearing plates [15][16][17][18][19][20], or if confinement effects should be introduced and measured [21][22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%