Shear test evaluation of the mechanical reliability of micro bumps in semiconductors

Cho, Yeungjung; Hahn, Mibbeum; Jeong, Hyunsik; Jang, Gunhee

doi:10.1007/s00542-021-05245-w

Cited by 3 publications

(4 citation statements)

References 10 publications

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“…However, this approach is not entirely representative of the actual structure as it does not consider the IMC, which prevents the relative displacement difference at the solder-PCB and -chip contacts. Some studies [27,28] have attempted to model IMC in failure simulations, but they only use elastic properties, which cannot yield sufficiently accurate results. To account for the IMC, a clear understanding of its inelastic properties is necessary, but this information is difficult to find in the literature and may require additional experimentation.…”

Section: Fe Modelingmentioning

confidence: 99%

“…This work aims to investigate the evolution of the inelastic deformation path of solder joints under external force conditions through numerical simulations. The motivation for this research stems from the fact that many studies have discussed the occurrence of failure in solder joints when the maximum stress exceeds a critical value [27,28]. However, there has been little discussion on how the stress varies significantly during the occurrence of inelastic deformation due to the change in the deformation path.…”

Section: Introductionmentioning

confidence: 99%

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Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Lim,

Lee,

Lee

2023

Applied Sciences

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Solder joints of ball grid arrays (BGA) have been widely used to connect electronic components to printed circuit boards (PCBs) and are often subjected to mechanical stress. Several studies have been conducted on the mechanical reliability of solder joints. While these studies have been useful in the industry, detailed studies on how the inelastic deformation path of the solder ball joints evolves under specific loading conditions have not been sufficiently reported. This study aims to understand how the inelastic deformation path evolves when a solder joint is subjected to a constant external force by utilizing the theory of mechanics. It has also been found that the mechanical failure is strongly influenced by the evolution history of the deformation modes in materials. For this study, an elastoplastic constitutive model and a ductile fracture criterion were implemented into the vectorized user-defined material (VUMAT) subroutine of the ABAQUS program for finite element (FE) analysis. With the model, the evolution of the inelastic deformation path of a single solder ball under different loading conditions was numerically analyzed. Three loadings (shear, compression, and bending) were chosen as the basic loading conditions. In addition, combinations of the basic loadings resulted in three dual loadings and one complex loading. The simulation results showed that the shear and bending caused the fracture for both single and dual loadings, but when combined with compression, the fracture was suppressed. The results indicate that fracture is not solely determined by the magnitude of equivalent plastic strain but also by the evolution of inelastic deformation mode. This research offers an improved understanding of the significance of the inelastic deformation path and fracture.

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Section: Fe Modelingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Lim,

Lee,

Lee

2023

Applied Sciences

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“…Furthermore, Lau et al (Lau et al, 2014) have evaluated the effect of solder joint geometry of ball grid array assembly with flexible and rigid PCBs on their reliability. (Cho et al, 2022) studied the effect of micro-bump structure and shear rate on the failure mode, and proposed a structural improvement to the bump. (Subbarayan et al, 1996) studied the effect of solder joint geometrical parameters on solder joint reliability, such as volume, height, pad size, etc.…”

Section: Introductionmentioning

confidence: 99%

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Reddad,

Zemzami,

Hami

et al. 2024

Preprint

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Metaheuristic optimization algorithms are powerful for solving complex optimization problems, almost when we lack information about the nature of their objective function. Meanwhile, the Finite Element Method (FEM) is a very powerful method for predicting and simulating the behavior of systems subjected to various stresses, whether electrical, thermal, mechanical, vibratory or magnetic. In the current study, we have proposed an optimization methodology that couples a metaheuristic algorithm - the Search and Rescue Algorithm (SAR) - with the finite element method. We then investigated the proposed methodology for optimizing the reliability of solder balls with respect to their geometry in a Ball Grid Array (BGA) assembly subjected to thermal cycling load. First, we performed a sensitivity analysis to determine the parameters influencing solder ball reliability, then we optimized the plastic deformation of solder balls, hence increasing their reliability as a function of their geometry through the proposed methodology, which results in improving the reliability of the entire electronic component.

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“…The main methods of micro bump preparation include electrodeposition, screen printing, solder injection and evaporation [ 15 , 16 ]. The electrodeposition method has been widely used in practical production because of its simple process, low cost, easy mass production, and high adaptability [ 17 , 18 ].…”

Section: Introductionmentioning

confidence: 99%

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

Tian

Qian

et al. 2023

Micromachines

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In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of chip packaging. Surface morphological defects are one of the main factors affecting the reliability of micro bumps, which are closely related to materials and bonding process parameters. In this paper, the electrodeposition process of preparing gold bumps is simulated at the atomic scale using the Kinetic Monte Carlo method. The differences in surface morphology and roughness of the plated layer are studied from a microscopic perspective under different deposition parameters. The results show that the gold micro bumps prepared by electrodeposition have better surface quality under conditions of lower deposition voltage, lower ion concentration and higher plating temperature, which can provide significant guidance for engineering applications.

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Shear test evaluation of the mechanical reliability of micro bumps in semiconductors

Cited by 3 publications

References 10 publications

Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

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