A 2-layer aluminum/polycarbonate (Al/PC) joint was fabricated between half specimens of typically dif cult to adhere Al and PC without use of welding, fasteners, rivets, chemical treatment or glue by a new double-step adhesion method: applying a low dose of homogeneous low energy electron beam irradiation (HLEBI) to only the PC connecting surface, prior to lamination assembly and hot press at 418 K for 3.0 min under 15 MPa pressure. Experimental results showed 0.30 MGy along with 0.22 MGy had adhesion created in all 11 samples of their data sets [11/11], although data sets of untreated (hot press alone), 0.04, 0.13 and 0. . Based on the 3-parameter Weibull equation, the statistically lowest o F p at P p = 0 (F s ) from 0.30 MGy-HLEBI was the highest value over all other data sets at 3.10 N·m . XPS (X-ray photoelectron spectroscopy) of the peeled Al side revealed a C(1s) peak shift in binding energy from 283.8 eV (C-C) to 284.3 eV (C=C), along with increase in O(1s) C=O peak intensity (531.8 eV) indicating the 0.30 MGy HLEBI generates increased reactive double bond (π-bond) sites which can explain stronger o