Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates

Hu, Xiaowu; Xu, Tao; Keer, Leon M.; Li, Yulong; Jiang, Xiongxin

doi:10.1016/j.jallcom.2016.08.168

Cited by 91 publications

(23 citation statements)

References 40 publications

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“…In the literature, investigating the reliability of isothermal aging of Sn-based lead-free solder joints has become an area of interest. Many scholars have studied the isothermal aging characteristics of SnAgCu/Cu [21][22][23][24][25], In-48Sn/Cu [26,27], and Sn-Bi/Cu [28,29] solder joints. They have focused on the growth kinetics of the interfacial IMC and the mechanical properties of solder joints during isothermal aging.…”

Section: Introductionmentioning

confidence: 99%

“…Besides, they obtained the activation energy of the interfacial IMC. Hu et al [23,24] further studied the relationships between the interfacial IMC and the fracture behavior of the Sn-3.0Ag-0.5Cu/Cu solder joints during isothermal aging. Nishikawa and Iwata [25] compared the reflow soldering and laser soldering and found that the growth of the interfacial IMC layer was slower by reflow soldering at the isothermal aging temperature 423 K. However, because of the slow reaction rate of the interfacial movement during isothermal aging, it is difficult to precisely measure the interfacial movement.…”

Section: Introductionmentioning

confidence: 99%

“…Nishikawa and Iwata [25] compared the reflow soldering and laser soldering and found that the growth of the interfacial IMC layer was slower by reflow soldering at the isothermal aging temperature 423 K. However, because of the slow reaction rate of the interfacial movement during isothermal aging, it is difficult to precisely measure the interfacial movement. To date, most methods used to investigate the growth kinetics and the interfacial movement during isothermal aging have used qualitative and statistical analysis [21][22][23][24][25], which cannot accurately reveal the constituents and growth of the interfacial IMC. Additionally, the relationship between the size and morphology of the interfacial IMC and the fracture mechanism of the solder joints during isothermal aging is not well understood.…”

Section: Introductionmentioning

confidence: 99%

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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao

Zhang

et al. 2020

Materials

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Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original single scallop-type Cu6Sn5 IMC gradually evolved into a planar double-layer IMC consisting of Cu6Sn5 and Cu3Sn IMCs with isothermal aging. In particular, the Cu3Sn IMC grew towards the Cu substrate and the solder seam sides; growth toward the Cu substrate side was dominant during the isothermal aging process. The growth of Cu3Sn IMC depended on the accumulated time at a certain temperature, where the growth rate of Cu3Sn was higher than that of Cu6Sn5. Additionally, the growth of the interfacial IMC was mainly controlled by bulk diffusion mechanism, where the activation energies of Cu6Sn5 and Cu3Sn were 74.7 and 86.6 kJ/mol, respectively. The growth rate of Cu3Sn was slightly faster than that of Cu6Sn5 during isothermal aging. With increasing isothermal aging time, the shear strength of the solder joints decreased and showed a linear relationship with the thickness of Cu3Sn. The fracture mechanism of the solder joints changed from ductile fracture to brittle fracture, and the fracture pathway transferred from the solder seam to the interfacial IMC layer.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao

Zhang

et al. 2020

Materials

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“…Micro solder-joints in 3D TSV packaging are commonly subjected to mechanical loading during serving [11]. It was well documented that the interfacial IMCs play an important role in the joint reliability because of their different mechanical properties [12,13]. However, the mechanical property effects dominated by higher volume fraction of the IMCs are not very well known.…”

Section: Introductionmentioning

confidence: 99%

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

et al. 2020

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The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationships between varying IMC volumes and mechanical properties of Ni/Sn(20μm)/Ni micro-joints. A designed method that followed the IMC volume as the only variable was used to prepare micro-joint samples with different IMC volumes. The continuously thickened Ni3Sn4 IMCs exhibited a noticeable morphology evolution from rod-like to chunky shape. The subsequent tensile tests showed unexpected tensile strength responses as increasing Ni3Sn4 volume, which was strongly associated with the Ni3Sn4 morphological evolutions. Fractographic analysis displayed that the ductile fracture dominates the 20%–40% IMC micro-joints, whereas the brittle fracture governs the 40%–80% IMC micro-joints. For the ductile fracture-dominated joints, an abnormal reduction in strength occurred as increasing IMCs volume from 20% to 40%. This is primarily due to severe stress concentrations caused by the transformed long rod-typed morphology of the Ni3Sn4. For the brittle fracture-dominated joints, the strength appeared a monotonous increase as the Ni3Sn4 volume increased. This may be attributed to the increased crack resistance resulting from continuous coarsening of the chunky Ni3Sn4 without any voids. Moreover, the finite element analysis was provided to further understand the joint failure mechanisms.

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“…Due to the destructive influence of Pbcontaining solder on the environment, the application of lead-free solder alloy received a wide attention [3]. Sn-3.0Cu-0.5Ag (SAC305) solder possesses good performance in thermal fatigue and solderability, and it has been widely used in microelectronics packaging [4][5][6][7][8]. SAC305 solder alloy has been widely considered as a representative lead-free solder.…”

Section: Introductionmentioning

confidence: 99%

Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

Zhang

et al. 2018

Acta Metall. Sin. (Engl. Lett.)

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In order to study the influence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0Ag-0.5Cu/Cu system, two kinds of experiments were designed, including: (1) solid-state aging between the solder and Cu substrate; (2) liquid-state aging between the metastable supercooled liquid-state solder and Cu substrate. The aging times were 30, 60, 120 and 180 min, respectively, and the aging temperature was 8°C lower than the melting point of the Sn-3.0Ag-0.5Cu (SAC305) alloy (217°C). The experimental data revealed that the physical state of the solder obviously affected the formation of the intermetallic compound (IMC), and resulted in the difference in the diffusion of atoms on the interface between the SAC305 solder and Cu substrate. The IMC interface after aging for 30 min presents unique characteristics compared with that of the sample after dip soldering. The IMC interface of solid-state aged SAC305/Cu couple is relatively planar, while the IMC interface under metastable supercooled liquid-state aging conditions presents scallop-like shape.

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Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates

Cited by 91 publications

References 40 publications

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

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