Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

Jin, Sanghun; Kim, Min‐Su; Kanayama, Shutetsu; Nishikawa, Hiroshi

doi:10.1016/j.microrel.2018.07.046

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…It is believed that the formation of IMCs had accumulated on heating at a longer and higher temperature because more heat will be introduced. Similar to the aging process, at high operating temperature the IMC growth rate was faster (Jin et al, 2018). The growth of IMC is controlled by the diffusion process over the temperature range.…”

Section: Structural Characterization Of Intermetallic Compoundsmentioning

confidence: 89%

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

Said

Nazeri

Sharif

et al. 2021

SSMT

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Purpose This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters. Design/methodology/approach Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view. Findings IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu6Sn5, Cu3Sn and Ag3Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

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Section: Structural Characterization Of Intermetallic Compoundsmentioning

confidence: 89%