Shape stabilized Al-Si/Al2O3 phase change composites for high temperature heat storage

Shi, Songcen; Liu, Renjie; Sheng, Nan; Chen, Zhu; Rao, Zhonghao

doi:10.1016/j.est.2022.106425

Cited by 7 publications

(6 citation statements)

References 20 publications

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“…The micro‐morphology was unchanged and the intact MEPCM particles were embedded within the skeleton structure without visible structural collapse or PCM melting leakage. Even in the enlarged image of 5000 cycles in Figure 7h,i, the thermal cycling deterioration phenomenon such as shell cracks, core leakage or microcapsule agglomeration [ 10,24 ] was rarely found. The presence and uniform distribution of various materials can be demonstrated by the EDS mappings of Figure 7j–n.…”

Section: Resultsmentioning

confidence: 99%

“…Comparison of latent heat loss rate during thermal cycles between this work and the references. [10,11,43,58,[72][73][74][75][76][77][78][79][80][81][82][83][84]…”

Section: Thermal Performance Of Cyclic Fspcmmentioning

confidence: 99%

“…Figure 11.Comparison of latent heat loss rate during thermal cycles between this work and the references [10,11,43,58,[72][73][74][75][76][77][78][79][80][81][82][83][84]. …”

mentioning

confidence: 93%

“…[3] The DOI: 10.1002/smll.202310252 development of high-temperature phase change materials (PCMs) for thermal energy storage is particularly critical, as they can meet the demands of high-temperature applications such as concentrated solar power, aerospace industries, and industrial waste heat recovery. [4] High-temperature PCMs (over 200 °C) encompass inorganic salt-based materials (e.g., nitrates, [5] carbonates, [6] sulfates, [7] fluoride [8] ), and metal-based materials (e.g., Al, [9] Al-Si, [10][11][12] Cu-Si [13] ). They offer advantages like high latent heat, high energy storage density, and low cost, enabling them to charge and release thermal energy at a high energy density.…”

Section: Introductionmentioning

confidence: 99%

“…[21] Currently, only a few microencapsulation technologies and formstable composite technologies are suitable for high-temperature PCM. Microencapsulation technologies primarily rely on in situ shell formation, [10,12,22,23] silicon-based precursor shells, [8,[24][25][26] and sol-gel methods, [27][28][29][30] all of which have demonstrated excellent corrosion protection and antioxidant properties for PCM cores. Nevertheless, the particle shells may be relatively fragile and unable to endure frequent melting-freezing cycles, potentially leading to issues like PCM leakage and microstructure failure.…”

Section: Introductionmentioning

confidence: 99%

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A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Wang,

Tao,

et al. 2024

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Addressing critical issues such as high‐temperature corrosion, leakage, degradation, and subpar cyclic performance is imperative for phase change materials (PCMs), prompting the development of appropriate encapsulation techniques to surmount these challenges. In this study, a dual encapsulation strategy is proposed for high‐temperature micro PCM particles. Al–Si core is microencapsulated via the “solvent evaporation‐heating curing” method. Subsequently, TiO2 is employed as the skeleton material for form‐stable encapsulation of PCM microcapsules by “cold pressed sintering”. Detailed analysis of the crystalline phase transformation mechanism in the sintering synthesis pathway of TiO2 underscore its potential as a robust structural material with exceptional thermal stability. Furthermore, the incorporation of hexagonal boron nitride (hBN) results in a substantial enhancement of the thermal conductivity of the composites, increasing by 121.1–131.3%. The prepared form‐stable phase change microcapsules (FSPCMs) are subjected to 5000 thermal cycles in the air atmosphere. There is no observed PCM leakage or composite ruptures in the FSPCM. Moreover, the oxidized mass gain is merely 3.3%, signifying exceptional oxidation resistance. Thermophysical analysis indicates that FSPCM can retain 91.3% of the enthalpy after 2000 cycles, with over 80% preservation after 5000 cycles, underscoring its remarkable cyclic thermal durability.

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Section: Resultsmentioning

confidence: 99%

“…Comparison of latent heat loss rate during thermal cycles between this work and the references. [10,11,43,58,[72][73][74][75][76][77][78][79][80][81][82][83][84]…”

Section: Thermal Performance Of Cyclic Fspcmmentioning

confidence: 99%

“…Figure 11.Comparison of latent heat loss rate during thermal cycles between this work and the references [10,11,43,58,[72][73][74][75][76][77][78][79][80][81][82][83][84]. …”

mentioning

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Wang,

Tao,

et al. 2024

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Thermal Expansion Challenges and Solution Strategies for Phase Change Material Encapsulation: A Comprehensive Review

Xu,

Shi,

et al. 2024

Adv Funct Materials

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Phase change materials (PCMs) have attracted increasing attention due to their efficient heat storage capability and small temperature fluctuation. And encapsulation has been recognized as an effective method to solve issues such as corrosion and leakage. For a long time, restricted by thermal expansion, encapsulation of PCMs has remained in the low‐temperature field and liquid‐state coating. In recent years, with the expansion of PCMs encapsulation into the medium and high temperature field and the development of solid‐state coating technology, encapsulation methods that consider thermal expansion have greatly improved the cycle life of encapsulated PCMs and make solid‐state coating of medium and high temperature PCMs possible. Herein, first, this paper summarizes the thermal expansion rates of common core and shell materials, as well as the thermal expansion behavior and stress analysis within confined spaces, proposing the necessity to solve thermal expansion issues. Subsequently, the solution strategies for solving thermal expansion issues in both macrocapsules and microcapsules are introduced. On this basis, the advantages and disadvantages of each strategy have been compared, and the applications of encapsulated PCMs after resolving thermal expansion issues have been introduced. Finally, the current issues, corresponding solutions, and future research directions have been put forward.

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A brief strategy for designing self-encapsulated Al-Si base phase change materials with high thermal energy storage performance

Wang

Huang

Wei

et al. 2023

Journal of Energy Storage

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Shape stabilized Al-Si/Al2O3 phase change composites for high temperature heat storage

Cited by 7 publications

References 20 publications

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Thermal Expansion Challenges and Solution Strategies for Phase Change Material Encapsulation: A Comprehensive Review

A brief strategy for designing self-encapsulated Al-Si base phase change materials with high thermal energy storage performance

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