“…[ 32 ] Furthermore, surface microstructures, such as micro‐tips, micro‐wedge arrays, and gecko‐mimicking systems, have been introduced to enhance the transfer performance of SMP‐based dry adhesives efficiently. [ 6 , 14 , 15 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 ] The Systems introduced in previous studies have implemented thermal deformation effects to achieve high adhesion forces during picking‐up and safely place substrates with low adhesion forces due to the recovery effect of microstructures. Despite their potential advantages, the current manufacturing process of SMP‐based adhesives remains time‐consuming.…”