Sewing and adhesive bonding technologies for smart clothing production

Abstract

PurposeThis paper aims to present investigations of the influence of sewing and adhesive bonding technology on the aesthetic, mechanical and conductive properties of the e-textile package. Commercially available conductive textiles are tested for the production of e-textile package by most common cut-and-sewn clothing production technologies.Design/methodology/approachSewing, adhesive bonding and seam sealing technologies used to obtain e-textile packages with woven and knitted conductive textiles. Produced e-textile packages described in terms of thickness, bending rigidity and general appearance. Exploitation properties of prepared samples tested by cycle tensile experiment and discussed on the basis of variation of linear electrical resistance property.FindingsResearch has shown that a reliable e-textile package can be obtained by applying cut-and-sew technology for conductive tracks of silver coated woven and knitted material. Seam sealing by thermoplastic polymer layer has an impact on the electrical and deformation properties of the samples. To create attractive smart clothing design, the appropriate joining method and its technological parameters must be chosen to ensure the durability and safety of e-textile packages.Originality/valueThe findings of the research are of substantial value for the production of e-textiles by cut-and-sewn technologies. The required shape of the conductive textile element for various applications can be cut and joined to the garment parts using traditional sewing or adhesive bonding techniques.