2019
DOI: 10.1109/tr.2019.2908269
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Service Reliability in an HC: Considering From the Perspective of Scheduling With Load-Dependent Machine Reliability

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Cited by 19 publications
(7 citation statements)
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“…PhCs are designed in one, two, and three-dimensional (3D) structures, whose two-dimensional (2D) structure has been considered by researchers due to its greater applications and fabrication simplicity. Research groups designed a variety of structures using two-dimensional PhCs such as optical filters [25][26][27][28][29][30][31][32], Full adders [33][34][35], encoders [36], comparators [37,38], Flip-Flop [39], analog-to-digital converters [40,41], registers [42,43], memories [44][45][46], sensors [47,48], Biosensors [49,50]. Photon crystals are designed in one-dimensional (1D), 2D and 3D, which is a proposed structure in the present research according to the 2D PhCs.…”
Section: Introductionmentioning
confidence: 99%
“…PhCs are designed in one, two, and three-dimensional (3D) structures, whose two-dimensional (2D) structure has been considered by researchers due to its greater applications and fabrication simplicity. Research groups designed a variety of structures using two-dimensional PhCs such as optical filters [25][26][27][28][29][30][31][32], Full adders [33][34][35], encoders [36], comparators [37,38], Flip-Flop [39], analog-to-digital converters [40,41], registers [42,43], memories [44][45][46], sensors [47,48], Biosensors [49,50]. Photon crystals are designed in one-dimensional (1D), 2D and 3D, which is a proposed structure in the present research according to the 2D PhCs.…”
Section: Introductionmentioning
confidence: 99%
“…1) Cores Reliability Model: We take into account five main failure effects for cores based on previous works [10], [29], [30], as follows:…”
Section: E Reliability Modelling Of the Server Processormentioning
confidence: 99%
“…1) Cores Reliability Model: We consider five main failure effects for cores based on previous works [31], [11], [51], [52], including the mean time to failure (MTTF) under the effects of EM (transport of material), SM (caused by mechanical stress), TDDB (caused by gate oxide breakdown), TC (caused by temperature cycling), and NBTI (increasing the transistors' threshold voltage).…”
Section: Reliability Modelling Of Server Processormentioning
confidence: 99%