Separation of wafer bonding interface from heterogenous mismatched interface achieved high quality bonded Ge-Si heterojunction

Ji, Ruoyun; Wang, Dan; Jiao, Jinlong; Yao, Liqiang; He, Fuxiu; Li, Cheng; Lin, Guangyang; Wang, Fuming; Huang, Wei; Chen, Songyan

doi:10.1016/j.apsusc.2024.160104

Applied Surface Science

2024

DOI: 10.1016/j.apsusc.2024.160104

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Separation of wafer bonding interface from heterogenous mismatched interface achieved high quality bonded Ge-Si heterojunction

Ruoyun Ji,

Dan Wang,

Jinlong Jiao

et al.

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Separation of wafer bonding interface from heterogenous mismatched interface achieved high quality bonded Ge-Si heterojunction

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References 49 publications

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