2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2021
DOI: 10.1109/siitme53254.2021.9663576
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Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment

Abstract: We present a sensor-based IoT monitoring of an electronics manufacturing laboratory in a university environment. The project focuses on the possibilities of retrofitting the current electronics manufacturing equipment (e.g., surface mount technology apparatus) with sensors to gather extensive in-situ information about the critical parameters of the machines and their ambient surroundings. The project is based on two different sensor nodes functioning as fixed and mobile measurement devices around the given poi… Show more

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