2008
DOI: 10.1063/1.2920435
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Sensitized erbium emission from silicon-rich nitride/silicon superlattice structures

Abstract: Erbium-doped silicon-rich nitride/silicon superlattice structures were fabricated by direct magnetron cosputtering deposition on Si substrates. Rapid thermal annealing resulted in the nucleation of small amorphous Si clusters, which efficiently sensitize 1.54 m emission via a nanosecond-fast nonresonant energy transfer process, providing an alternative route toward the fabrication of Si-compatible devices based on Er sensitization.

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Cited by 62 publications
(46 citation statements)
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“…However, because of the growing concern over environmental issues, LEDs using Si have recently been investigated. For example, in the visible region, porous Si [4], Si/SiO 2 superlattice structures [5,6], and Si nanoprecipitates in SiO 2 [7] have been used, and in the infrared region, erbium-doped Si [8] and Si-Ge [9] have been used. However, their emission efficiencies are still low.…”
Section: Introductionmentioning
confidence: 99%
“…However, because of the growing concern over environmental issues, LEDs using Si have recently been investigated. For example, in the visible region, porous Si [4], Si/SiO 2 superlattice structures [5,6], and Si nanoprecipitates in SiO 2 [7] have been used, and in the infrared region, erbium-doped Si [8] and Si-Ge [9] have been used. However, their emission efficiencies are still low.…”
Section: Introductionmentioning
confidence: 99%
“…Electronic-photonic integration on Si meets the needs for highbandwidth and low-power-density on-chip interconnects [1,2]. Since Si shows a very inefficient band-to-band radiative recombination due to its indirect band gap nature, erbium-doped silicon dielectrics [3][4][5][6] and silicon Raman effect [7,8] have been used for light emission at the desired wavelength band around 1550 nm. However, the challenge of electrical pumping for the above approaches remains to be solved.…”
mentioning
confidence: 99%
“…Therefore, defects are created rather than Si-nps, after thermal annealing. Moreover, due to the low difusivity of silicon atoms in Si 3 N 4 , a high Si content (>52 at.%) is needed to form Si-nps [59,60]. Because of the low Si content present in the SRN ilms from this work (<46 at.%), as shown above in the XPS results, these ilms can be explained as a sub-stoichiometric nitride with structural defects, as reported in the study of Cabañas-Tay et al [34].…”
Section: Silicon-rich Nitride (Srn) Ilmmentioning
confidence: 99%