Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies

Wu, Kuan‐Wen; Lin, Zhao-He; Chou, Hsi‐Tseng; Shen, Pin-Zhong; Lin, Ding‐Bing; Yang, Chao‐Shun; Chou, Chieh-Wei; Pan, Chi-Liang; Lin, Ji-Cheng; Fang, Li-Chih

doi:10.1109/ectc32696.2021.00102

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021

DOI: 10.1109/ectc32696.2021.00102

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Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies

Kuan‐Wen Wu

Zhao-He Lin

Hsi‐Tseng Chou

et al.

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Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies

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