Semicrystalline and amorphous fluorine-containing polyimides

Rogers, Martin E.; Brink, M.; McGrath, James E.; Brennan, Anthony B.

doi:10.1016/0032-3861(93)90373-i

Cited by 40 publications

(14 citation statements)

References 3 publications

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“…In the past it was shown that the incorporation of fluorinecontaining monomers would increase the thermo-oxidative stability (TOS) and lowers the dielectric constant as well as moisture absorption in the polyimide polymers. [10][11][12][13][14][15][16] However, low dielectric constant, high performance fluoropolyimides, such as SIXEF TM PI from Hoechst Celanese Corp. generally were expensive. [13][14][15] For some niche electronic applications the high cost may not be the determining factor.…”

Section: Introductionmentioning

confidence: 99%

“…Similarly, incorporation of inorganic clay leads to high thermal stability, but at the expense of fracture toughness and mechanical properties. In the past it was shown that the incorporation of fluorine‐containing monomers would increase the thermo‐oxidative stability (TOS) and lowers the dielectric constant as well as moisture absorption in the polyimide polymers 10–16. However, low dielectric constant, high performance fluoropolyimides, such as SIXEF™ PI from Hoechst Celanese Corp. generally were expensive 13–15…”

Section: Introductionmentioning

confidence: 99%

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Preparation and Characterization of 4,4′‐Bis(4‐aminophenoxy)diphenyl Sulfone Based Fluoropoly(ether‐imide)/Organo‐Modified Clay Nanocomposites

Vora

Pallathadka

Goh

et al. 2003

Macro Materials & Eng

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A series of fluoropoly(ether‐imide) (6F‐PEI), and [6F‐PEI/montmorillonite (MMT) clay) nanocomposites films were made by thermal curing of respective formulations containing fluoropoly(ether‐amic acid) (6F‐PEAA), synthesized from 2,2′‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 4,4′‐bis(4‐aminophenoxy)diphenyl sulfone (p‐SED), and increasing concentration of p‐SED treated montmorillonite clay (modified MMT clay) at temperature from RT to 350 °C. These films showed excellent solvent resistance as well as very good thermal stability, and increased glass transition (Tg) values with increasing % clay. In addition, these trifluoromethyl groups‐containing nanocomposites films showed sharp lowering of coefficient of thermal expansion (CTE) by 22%. Furthermore, they exhibited increased long‐term thermo‐oxidative stability (TOS), with % weight retention in the range of 86 to 92% in isothermal heating at 300 °C for 300 h in air, reduced water absorption at 100 RH at 50 °C in the range of 0.5 to 1.15%. These data are still much lower than those of neat ULTEM® 1000 and Kapton® H film. The modulus of elasticity is on an average 38% higher for the nanocomposite films relative to neat fluoropoly(ether‐imide) (6FDA + p‐SED), and above non‐fluorinated polyimide films. The surface energy measurement by One‐Liquid and Two‐Liquid method showed a comparable trend of decreasing contact angle. For the nanocomposite films having 15% hydrophobic clay, the contact angle decreased by 21 and 20% for DI‐water and formamide, respectively. The surface energy increase was in the range of 8.21–8.54 mJ/m2.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Preparation and Characterization of 4,4′‐Bis(4‐aminophenoxy)diphenyl Sulfone Based Fluoropoly(ether‐imide)/Organo‐Modified Clay Nanocomposites

Vora

Pallathadka

Goh

et al. 2003

Macro Materials & Eng

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“…Due to their excellent thermal stability, good mechanical properties, and low thermal expansion, aromatic polyimides have been widely used in aerospace, microelectronics, optoelectronics, and high‐performance composites 1–4. However, a major drawback of aromatic polyimides is their high melting temperature, which makes them impossible to be directly processed in their imidized forms 5–8. In addition, most polyimides are amorphous, which often leaves them susceptible to attack by solvents.…”

Section: Introductionmentioning

confidence: 99%

Synthesis, characterization, and crystallization of thermoplastic aromatic semi‐crystalline poly(ester‐imide)s based on bis(trimellitic acid anhydride) phenyl ester

Guo

2010

Polymers for Advanced Techs

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A high molecular weight aromatic homopoly(ester-imide) (homoPEI) was synthesized from homopoly(ester-amic acids) (homoPEAA), which was obtained from the reaction of bis(trimellitic acid anhydride) phenyl ester (BTAH) with 4-4'-oxydianiline ether (ODA). This homoPEI was melt-processable semi-crystalline polymer and displayed dual endothermic transitions which were attributed to the different levels of crystal perfection and size in the crystal structures. Four high molecular weight aromatic copoly(ester-imide)s (coPEIs) were synthesized via copoly(ester-amic acids)s (coPEAA) from the reaction of 4, 4'-oxydiphthalic anhydride (ODPA) and BTAH with ODA. The molar percentage of BTAH varied from 10 to 40%. When the molar percentages of BTAH were 30 and 40%, the resulting two coPEIs were crystallinable and their melting temperatures were 361-C and 356/371-C, respectively. Differential scanning calorimetry (DSC) and wide angle X-ray diffraction (WAXD) results indicated that the crystal structures included short segments of BTAH/ODA and ODPA/ODA. The initial crystallization of the two coPEIs took place during imidization process. Thermogravimetric (TA) and mechanical analysis confirmed that both homoPEI and coPEIs showed almost no weight loss until 400-C in N 2 and good mechanical properties.

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“…The approaches that have been taken to achieve these results include introducing an angular or flexible linkage into the backbone; introducing a kinked linkage ( meta ‐ and ortho ‐catenations) or an unsymmetrical and cardo (loop) structure; incorporating a large polar or nonpolar pendant bulky group along the polymer backbone; or disrupting the symmetry of the polymer chain via copolymerization. Flexible or angular units have also been introduced within the polymer backbone to inhibit interchain interactions, to lower phase transition temperatures, and thus promote solubility and flowability 10–15…”

Section: Introductionmentioning

confidence: 99%

Soluble rigid poly(imide‐siloxane)s: Synthesis, characterization, and structure‐property relations

Srividhya

Reddy

2008

J of Applied Polymer Sci

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Three different poly(imide-siloxane)s (PIS) containing rigid imide groups were synthesized by the reaction of amine end-capped imides to the siloxane backbone. These highly soluble amine terminated imides were synthesized by reacting fluorinated anhydride and three different amines (DDBP, DDM, DBP). The imides were grafted to the siloxane backbone by the epoxy group cleavage. All the polymers were obtained in quantitative yields with the inherent viscosities ranging from 0.32 to 0.45 dL/g. The polymers were characterized by FTIR, 1 H and 13 C NMR, and their thermal properties were studied. The DSC results showed two distinct glass transition temperatures demonstrating the existence of phase separation between the hard imide and soft siloxane groups. Polymeric membranes were prepared employing the coupling reaction between PIS and the polydimethylsiloxane matrix by varying the amount of incorporation of PIS. The membranes showed a high tensile strength of 82 MPa. The contribution of polar and dispersion component towards the total surface energy was studied by the contact angle measurements, and a reduction in surface tension of 15 mN/m was achieved with the fluorine containing PIS membrane. The study of the surface morphology was studied which confirmed the existence of phase separation in these systems.

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Semicrystalline and amorphous fluorine-containing polyimides

Cited by 40 publications

References 3 publications

Preparation and Characterization of 4,4′‐Bis(4‐aminophenoxy)diphenyl Sulfone Based Fluoropoly(ether‐imide)/Organo‐Modified Clay Nanocomposites

Preparation and Characterization of 4,4′‐Bis(4‐aminophenoxy)diphenyl Sulfone Based Fluoropoly(ether‐imide)/Organo‐Modified Clay Nanocomposites

Synthesis, characterization, and crystallization of thermoplastic aromatic semi‐crystalline poly(ester‐imide)s based on bis(trimellitic acid anhydride) phenyl ester

Soluble rigid poly(imide‐siloxane)s: Synthesis, characterization, and structure‐property relations

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