Semiconductor wafer defect detection using digital holography

Schulze, Mark A.; Hunt, Martin A.; Voelkl, E.; Hickson, Joel D.; Usry, William R.; Smith, Randall G.; Bryant, R.; Thomas, C. E.

doi:10.1117/12.485237

Cited by 29 publications

(13 citation statements)

References 26 publications

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“…These results are good considering the use of 532nm illumination for the inspection. Further discussion of SHI for wafer inspection is available in [4]. …”

Section: Figure 5 Shi Phase Image Of Har Via Array With Single Partimentioning

confidence: 99%

Spatial heterodyne interferometry techniques and applications in semiconductor wafer manufacturing

et al. 2004

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Spatial heterodyning is an interferometric technique that allows a full complex optical wavefront to be recorded and quickly reconstructed with a single image capture. Oak Ridge National Laboratory (ORNL) has combined a highspeed, image capture technique with a Fourier reconstruction algorithm to produce a method for recovery of both the phase and magnitude of the optical wavefront. Single frame spatial heterodyne interferometry (SHI) enables high-speed inspection applications such as those needed in the semiconductor industry. While the wide range of materials on wafers make literal interpretation of surface topology difficult, the wafers contain multiple copies of the same die and die-to-die comparisons are used to locate defects in high-aspect-ratio structures such as contacts, vias, and trenches that are difficult to detect with other optical techniques. Metrology with SHI has also been investigated by ORNL, in particular the use of SHI to perform metrology of line widths and heights on photolithographic masks for semiconductor wafer production. Several types of masks are currently in use with phase shifting techniques being employed to extend the wafer printing resolution. With the ability to measure the phase of the wavefront, SHI allows a more complete inspection and measurement of the phase shifting regions.

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“…These results are good considering the use of 532nm illumination for the inspection. Further discussion of SHI for wafer inspection is available in [4]. …”

Section: Figure 5 Shi Phase Image Of Har Via Array With Single Partimentioning

confidence: 99%

Spatial heterodyne interferometry techniques and applications in semiconductor wafer manufacturing

et al. 2004

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“…A Mach-Zehnder interferometer is used in a digital holography system as depicted in Figure 1 [2] [3]. This optical system is configured geometrically with a small tilted angle between the object and reference beam, which combine together and generate interference fringes at the CCD imaging plane after the beam splitter.…”

Section: Fig 1 Digital Holograph Systemmentioning

confidence: 99%

Application of autofocus algorithms in holographic reconstruction

Shen

Chen

2009

SPIE Proceedings

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A digital holographic reconstruction in the frequency and spatial domain is presented in this paper. This technique applies Fourier transform on heterodyne hologram with interference fringes then the complex amplitude and phase information are extracted from its sidebands. Reconstruction of the phase and amplitude image is completed through inverse Fourier transform back to spatial domain. For best holographic reconstruction qualities, a blind deconvolution filtering and an image based autofocus spatial processing are also adopted and discussed. Experiments show satisfying reconstruction results.

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“…In order to detect defects, the standard image should be presented. Reference [9] detects defects using digital holography, the standard images are also required. References [10]- [12] only can detect the defects of well-regulated patterning.…”

Section: Introductionmentioning

confidence: 99%

Defect Detection of IC Wafer Based on Spectral Subtraction

Liu

Zhou

Kuang

et al. 2010

IEEE Trans. Semicond. Manufact.

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In this paper, spectral subtraction is successfully applied to image processing and to detect defects in the integrated circuit (IC) image. By utilizing the characteristics of many of the same chips in a wafer, three images with defects located in the same position and different chips are obtained. The defect images contain the spectrum of standard image without any defects. Spectral subtraction presented in the paper can extract the standard image from the three defect images. The algorithm complexity of spectral subtraction detecting defects is close to that of Fourier transform. After obtaining the standard image, the speed and accuracy of defects detection can be greatly enhanced using the detection method presented in the paper. Using the image gray-scale matching technology, impact of illumination on IC defect detection is solved. Experiments demonstrate that spectral subtraction is fast and accurate to defect detection in an IC image, and the method has high robustness for illumination.

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Semiconductor wafer defect detection using digital holography

Cited by 29 publications

References 26 publications

Spatial heterodyne interferometry techniques and applications in semiconductor wafer manufacturing

Spatial heterodyne interferometry techniques and applications in semiconductor wafer manufacturing

Application of autofocus algorithms in holographic reconstruction

Defect Detection of IC Wafer Based on Spectral Subtraction

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