Wiley Encyclopedia of Electrical and Electronics Engineering 1999
DOI: 10.1002/047134608x.w3226
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Semiconductor–Insulator Interfaces

Abstract: The sections in this article are Si–SiO 2 Interface Compound‐Semiconductor–Insulator Interfaces

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Cited by 13 publications
(12 citation statements)
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“…2×2 cm 2 cleaved GaAs pieces were degreased by immersing into acetone and methanol for 5 min each. The surface native oxides were removed by diluted HCl etching for 3 min and the cleaned GaAs was passivated in diluted 5% (NH 4 ) 2 S aqueous solution for 15 min (S-passivated GaAs).…”
Section: Methodsmentioning
confidence: 99%
“…2×2 cm 2 cleaved GaAs pieces were degreased by immersing into acetone and methanol for 5 min each. The surface native oxides were removed by diluted HCl etching for 3 min and the cleaned GaAs was passivated in diluted 5% (NH 4 ) 2 S aqueous solution for 15 min (S-passivated GaAs).…”
Section: Methodsmentioning
confidence: 99%
“…Usually the body terminal is connected to the highest or lowest voltage within the circuit, depending on the type of the FET. The body terminal and the source terminal are sometimes connected together since the source is often connected to the highest or lowest voltage within the circuit, although there are several uses of FETs which do not have tion, such as transmission gates [2], [3], [5].…”
Section: Deposition Techniquementioning
confidence: 99%
“…These efforts did not result in the desired Fermi level unpinning in insulator/GaAs hetero-structures. 7,8) A groundbreaking advancement in unpinning the Fermi level of GaAs was achieved using a mixed oxide of Gd 2 O 3 (Ga 2 O 3 ) [GGO] on GaAs, deposited through e-beam evaporation of a Gd 3 Ga 5 O 12 target in ultra-high vacuum (UHV). 9) This approach enabled the successful demonstration of depletion-mode (D-mode) GaAs MOSFETs with high drain current (I d ) and transconductance (G m ), 10,11) as well as the first inversion-channel GaAs MOSFET.…”
Section: Introductionmentioning
confidence: 99%