SEM Examination and Analysis of the Interface Character in Surface Modified Aramid-Epoxy Composite

Hussain, Saleem Azara; Khan, Mohammad Bilal; Hussain, Rizwan

doi:10.4028/www.scientific.net/kem.510-511.443

Cited by 3 publications

(2 citation statements)

References 13 publications

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“…The above operations were repeated for in situ observation and analysis of changes in the microscopic topography. [ 35 ] For the other part, the silver glue powder was scraped off and mixed with potassium bromide at a mass ratio of ≈1/150, ground into a fine powder, and pressed into a sample film with a special die tablet press. Then, the FTIR spectrometer, TENSOR27, was implemented to analyze the FTIR spectra of hydroxyl and epoxy functional groups in epoxy resins.…”

Section: Methodsmentioning

confidence: 99%

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

Wang

Zhao

et al. 2022

Adv Materials Inter

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heat transfer performance of TIM, and the test methods normally include two categories: steady-state and transient methods. However, the present ITR testing methods still suffer from sample damage and low accuracy. [4] Thus, a non-destructive ITR testing method with high accuracy is urgently needed, which is critical for promoting the development of TIM.Submicron silver has become a promising TIM owing to its high thermal conductivity and strong adhesion, which can greatly reduce the ITR. [5][6][7][8] However, the thermal reliability of the silver-adhesive interface is still a major issue. Numerous studies focused on the degradation of properties, such as mechanical strength, material oxidation, and electrochemical corrosion through the test of high temperature, high humidity, and temperature cycling. [9][10][11][12][13][14] Liu et al. reported that conductive adhesive would undergo further curing, hydrolysis, and oxidation under high temperature and humidity, but it did not provide in-depth theoretical explanations. [15] Lin et al. found that the hydrothermal environment induced the hygroscopic expansion of epoxy resin and weakened the absorption peak of the epoxyfunctional group by Fourier transforming infrared (FTIR) spectrum analysis. [16] Several studies hypothesized that the number, size, and shape of porosity would interrupt the interface thermal conduction path, and thus, decrease the equivalent thermal conductivity. However, the evolution of porosity during the aging process is not investigated. [17][18][19] Skuriat studied the change in micro-morphology under high-temperature aging of Thermal interface materials (TIM) represented by submicron silver adhesive provide a promising solution for ultra-high heat dissipation in chip integration. However, it is difficult to accurately characterize the thermal performance of submicron silver adhesive interfaces, and their high-temperature degradation mechanism still remains unclear. Herein, the accelerated high-temperature aging experiments of submicron silver adhesion interfaces are performed, and a non-destructive testing method is provided to measure the degeneration of interfacial thermal resistance (ITR). After performing the two-sided test, ITR can be extracted with an error of less than 4.6%. Based on scanning electron microscopy and X-ray microstructural analysis, the microstructural evolution of silver adhesive interfaces is presented and its high-temperature degradation mechanism is determined. It is observed for the first time that ITR would change with the aging time following a bathtub curve. Such a degenerative process can be evidently divided into three stages including secondary solidification, fluctuation, and failure. In addition, a physical model is developed to interpret the degradation mechanism of ITR at high temperatures. The change in the trend of submicron silver body and TIM-solid contact thermal resistance at different stages is presented. This work helps promote submicron silver's application as high-performance TIM.

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Section: Methodsmentioning

confidence: 99%

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

Wang

Zhao

et al. 2022

Adv Materials Inter

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“…5,6 The interface of the fiber-reinforced composites acts as the bridge for stress transferring, which is essential for achieving the excellent mechanical properties. 7–9 Thus, it’s necessary to modify the AF to increase the fiber surface activity and further improve the interface adhesion of the composites.…”

Section: Introductionmentioning

confidence: 99%

Non-destructive modification of aramid fiber by building nanoscale-coating solution to enhance the interfacial adhesion properties of the fiber-reinforced composites

Wang

Zhang

et al. 2020

Journal of Composite Materials

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The poor interfacial adhesion between the aramid fiber (AF) and the matrix limits the application of the final composites. In this study, a novel coating method was adopted to modify AF Through metallization/grafting reaction, the copolymer synthesized by the low-temperature poly-condensation of p-phenylenediamine (PPDA), 4,4′-diaminodiphenyl ether (ODA) and terephthaloyl dichloride (TPC), was added into the dimethyl sulfoxide/sodium hydride (DMSO/NaH) solution, and a nano AF solution was obtained. Then epoxy groups were introduced to the amide bond by grafting Epichlorohydrin (ECH). By further grafting on Poly (propylene glycol) bis (2-aminopropyl ether) (PEA), more functional groups were introduced, which could increase the polarity of the fiber and the interfacial adhesion of the composites. The results show that not only the interfacial shear strength (IFSS) and the flexural strength of the aramid-reinforced composites has a significant increase compared with the untreated fibers, but the modification still maintains the mechanical properties of the fiber, indicating that building nanoscale coating solution is a very effective method to achieve non-destructive modification to ehance its interfacial adhesion with epoxy resin.

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Critical review on advancements on the fiber-reinforced composites: Role of fiber/matrix modification on the performance of the fibrous composites

Sharma,

Kumar,

Rana

et al. 2023

Journal of Materials Research and Technology

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SEM Examination and Analysis of the Interface Character in Surface Modified Aramid-Epoxy Composite

Cited by 3 publications

References 13 publications

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

Non-destructive modification of aramid fiber by building nanoscale-coating solution to enhance the interfacial adhesion properties of the fiber-reinforced composites

Critical review on advancements on the fiber-reinforced composites: Role of fiber/matrix modification on the performance of the fibrous composites

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