Self-assembling MEMS variable and fixed RF inductors

Lubecke, Victor M.; Barber, Bradley P.; Chan, King Yuk; López, D.; Gross, Malte; Gammel, P. L.

doi:10.1109/22.963142

Cited by 120 publications

(45 citation statements)

References 8 publications

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“…Another approach exploits the strain engineering to fabricate RF components. In this case the stress induced in metal layer during the fabrication can be used for selfassembling purposes of air suspended inductor featuring higher quality factor [13].…”

Section: Rf Mems Technologies and Devicesmentioning

confidence: 99%

RF MEMS status and perspectives

Coccetti¹,

Peyrou²,

Ahmad³

et al. 2008

Phys. Status Solidi (c)

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Entgegen landläufiger Meinung katalysiert [Co4(CO)12] sehr wohl die Pauson‐Khand‐Reaktion unter normalen Laborbedingungen (70°C, 1 atm CO) [Gl. (1)]. Mit Zusätzen wie Cyclohexylamin oder Pyridin, die vermutlich die Disproportionierung in die katalytisch aktive Cobalt‐Spezies begünstigen, konnte die katalytische Wirkung gesteigert werden. Die erfolgreiche Verwendung des kommerziell erhältlichen, vergleichsweise stabilen [Co4(CO)12]‐Clusters als Katalysatorvorstufe zeigt, dass die Entstehung von [Co4(CO)12] bei der durch [Co2(CO)8] katalysierten Pauson‐Khand‐Reaktion keineswegs in eine Sackgasse führt.

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Section: Rf Mems Technologies and Devicesmentioning

confidence: 99%

RF MEMS status and perspectives

Coccetti¹,

Peyrou²,

Ahmad³

et al. 2008

Phys. Status Solidi (c)

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“…Building true three-dimensional geometry is a major challenge for the MEMS community, most mature MEMS being bidimensional microstructures involving only lateral movements (except perhaps micro-mirrors). Self-assembling microstructures are mainly studied for the development of out-of-plane inductors, which allow isolation from the lossy silicon substrate, improving quality factor and self-resonance frequency [18]. Various techniques, such as melt hinge pad [19] or plastic deformation magnetic assembly [20] are used to generate out-ofplane deflections.…”

Section: D Surface Micromachined Microstructuresmentioning

confidence: 99%

Bulk and surface micromachined MEMS in thin film SOI technology

Raskin

Iker

André

et al. 2007

Electrochimica Acta

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“…Since such variable inductor uses a piezoelectric planar actuator its power consumption is very low when compared to the solutions presented in [7,8].…”

Section: Introductionmentioning

confidence: 98%

“…An approach to design a true MEMS variable inductor is presented in [7]. The inductor consists of two loops that are self assembled above the substrate using the residual stress between the polysilicon and gold layers with a relative angle between them.…”

Section: Introductionmentioning

confidence: 99%

RF VCO tuning using MEMS piezoelectric actuated variable inductors

Casha

Grech

Micallef

et al. 2011

Analog Integr Circ Sig Process

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This paper presents a study on the use of microsystems technology in the design of radio frequency voltage-controlled oscillators. In particular, the application of a micro-electro-mechanical systems (MEMS) based variable inductor for frequency tuning purposes is presented. Although traditionally a MEMS variable inductor is considered as a means to extend the tuning range, in this work it is shown that with correct inductor design it is also possible to facilitate and improve the voltage-controlled oscillator design in terms of phase noise response and power consumption in comparison to a design based on standard capacitive tuning.

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Self-assembling MEMS variable and fixed RF inductors

Cited by 120 publications

References 8 publications

RF MEMS status and perspectives

RF MEMS status and perspectives

Bulk and surface micromachined MEMS in thin film SOI technology

RF VCO tuning using MEMS piezoelectric actuated variable inductors

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