1997
DOI: 10.1116/1.589243
|View full text |Cite
|
Sign up to set email alerts
|

Selective wet etching for highly uniform GaAs/Al0.15Ga0.85As heterostructure field effect transistors

Abstract: Articles you may be interested inHighly selective and low damage atomic layer etching of In P ∕ In Al As heterostructures for high electron mobility transistor fabrication Appl. Phys. Lett. 91, 013110 (2007); 10.1063/1.2754636 Study of highly selective wet gate recess process for Al 0.25 Ga 0.75 As/GaAs based pseudomorphic high electron mobility transistors

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
5
0

Year Published

2003
2003
2012
2012

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 24 publications
(5 citation statements)
references
References 5 publications
0
5
0
Order By: Relevance
“…Some reports discussed the influence of gate recess dry etching in HEMTs [1,2]. Recently, highly selective chemical wet etching was developed and used for gate recessing of HEMTs for avoiding plasma damage [3][4][5]. Even then, we were aware of the degradation of carrier density and electron mobility in P-HEMTs by our experience.…”
Section: Introductionmentioning
confidence: 89%
“…Some reports discussed the influence of gate recess dry etching in HEMTs [1,2]. Recently, highly selective chemical wet etching was developed and used for gate recessing of HEMTs for avoiding plasma damage [3][4][5]. Even then, we were aware of the degradation of carrier density and electron mobility in P-HEMTs by our experience.…”
Section: Introductionmentioning
confidence: 89%
“…The selectivity of GaAs and AlGaAs with present NH 4 OH/H 2 O 2 mixture is usually several tens to hundreds, 19 and could be improved by optimization of the etching. Note that these nanotubes are another proof of the formation of core-shell nanowires from SA-MOVPE and simple etching processes.…”
Section: -mentioning
confidence: 99%
“…Definition of the resonator geometry in the Al x Ga 1−x As epilayers relies on electron cyclotron resonance etching through the mirror stack using Cl 2 /Ar, with masking provided by the resist/SiN x . To undercut the cantilevers, a buffered citric acid solution is utilized [28]. This selective wet etch allows for the removal of the binary GaAs, in this case the substrate, over the low-aluminum content ternary Al 0.12 Ga 0.88 As layers with excellent selectivity [26].…”
mentioning
confidence: 99%