Selective surface modification of PET substrate for inkjet printing

Yeo, L. P.; Lok, B. K.; Nguyen, Q M P; Lu, Chuanhe; Lam, Yee Cheong

doi:10.1007/s00170-014-5634-9

Cited by 17 publications

(12 citation statements)

References 13 publications

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“…droplets have been reported in the literature. [34][35][36] In these methods, a self-assembled monolayer (SAM) of silane or fluorocarbon was first introduced onto the substrate surface. Argon (Ar) or oxygen (O 2 ) plasma was then used to induce a bond-cleavage reaction and thus modify the surface wettability.…”

Section: Introductionmentioning

confidence: 99%

“…Argon (Ar) or oxygen (O 2 ) plasma was then used to induce a bond-cleavage reaction and thus modify the surface wettability. [35,36] UV radiation was also applied for grafting additional chemicals by specific design of photoreaction chemistry as an alternative approach. [34] To maintain hydrodynamic stability of printed liquid lines, a nearly zero receding contact angle (CA) (θ r ) is necessary.…”

Section: Introductionmentioning

confidence: 99%

“…As pointed out by Stringer et al., the surface wettability is an important parameter influencing the size of features generated by inkjet printing. A few experimental investigations for controlling the wetted radius of printed individual droplets have been reported in the literature . In these methods, a self‐assembled monolayer (SAM) of silane or fluorocarbon was first introduced onto the substrate surface.…”

Section: Introductionmentioning

confidence: 99%

“…In these methods, a self‐assembled monolayer (SAM) of silane or fluorocarbon was first introduced onto the substrate surface. Argon (Ar) or oxygen (O 2 ) plasma was then used to induce a bond‐cleavage reaction and thus modify the surface wettability . UV radiation was also applied for grafting additional chemicals by specific design of photoreaction chemistry as an alternative approach .…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Inkjet Printing Controllable Polydopamine Nanoparticle Line Array for Transparent and Flexible Touch‐Sensing Application

Liu

Pei

et al. 2020

Adv Eng Mater

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A cost‐effective and environmentally benign inkjet‐printing technique is reported for fabrication of ultra‐fine polydopamine (PDA) nanoparticle line arrays (NPLAs) with controllable line‐to‐line spacing (pitch size). The narrowest single line width achieved is 4.7 μm, and tunable pitch size ranging from 77 to 380 μm is also achieved by exploitation of the evaporation‐driven convective particle self‐assembly mechanism. Controllable pitch size is accomplished by printing on hydrophobically recovered polyethylene terephthalate (PET) substrates after oxygen plasma treatment. A theoretical model is developed to investigate the NPLA growth mechanism, which shows good agreement with experimental measurements. Conversion of the NPLA to electrically conductive structure is achieved by a subsequent silver electroless metallization process. The fabrication of a transparent capacitive touch sensor as an application of this approach is also demonstrated. This technique offers manufacturing of conductive narrow lines by additive means with the advantages of low cost, low process temperature, and minimal environmental impact.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Inkjet Printing Controllable Polydopamine Nanoparticle Line Array for Transparent and Flexible Touch‐Sensing Application

Liu

Pei

et al. 2020

Adv Eng Mater

View full text Add to dashboard Cite

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“…The removal of contaminants such as sulphides, inorganic oxide, silicone oil and carbon black can be carried out using mechanical methods, chemical cleaning methods, dry ice blasting, ultrasonic cleaning methods, laser cleaning methods and plasma cleaning methods. Although the above conventional methods [1][2][3][4][5] are applicable to clean moulds, it is impossible to reduce the adhesion between the rubber or plastic products and the mould surfaces. Due to the physical adsorption, interface reaction, and mould shrinkage, adhesion may occur between rubber or plastic parts and moulds.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of anti-adhesion surfaces on aluminium substrates of rubber plastic moulds using electrolysis plasma treatment

et al. 2014

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An anti-adhesion surface with a water contact angle of 167° was fabricated on aluminium samples of rubber plastic moulds by electrolysis plasma treatment using mixed electrolytes of C6H5O7(NH4)3 and Na2SO4, followed by fluorination. To optimise the fabrication conditions, several important processing parameters such as the discharge voltage, discharge time, concentrations of supporting electrolyte and stearic acid ethanol solution were examined systematically. Using scanning electron microscopy (SEM) to analyse surfaces morphology, micrometer scale pits, and protrusions were found on the surface, with numerous nanometer mastoids contained in the protrusions. These binary micro/nano-scale structures, which are similar to the micro-structures of soil-burrowing animals, play a critical role in achieving low adhesion properties. Otherwise, the anti-adhesion behaviours of the resulting samples were analysed by the atomic force microscope (AFM), Fourier-transform infrared spectrophotometer (FTIR), electrons probe micro-analyzer (EPMA), optical contact angle meter, digital Vickers microhardness (Hv) tester, and electronic universal testing. The results show that the electrolysis plasma treatment does not require complex processing parameters, using a simple device, and is an environment-friendly and effective method. Under the optimised conditions, the contact angle (CA) for the modified anti-adhesion surface is up to 167°, the sliding angle (SA) is less than 2°, roughness of the sample surface is only 0.409μm. Moreover, the adhesion force and Hv are 0. 9KN and 385, respectively.

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Recent Developments of Inkjet‐Printed Flexible Energy Storage Devices

Wang

et al. 2022

Adv Materials Inter

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involving material exploration, structure design, and fabrication innovation. [6][7][8][9][10][11] Currently, flexible EES devices are fabricated through two main strategies: i) Utilization of intrinsic flexible materials. For example, carbon materials and conductive polymers are widely applied as EES electrodes, and polymers like Nafion, polyacrylamide (PAM), and polyethylene oxide (PEO) are used as electrolytes, and polymer matrixes such as polydimethylsiloxane (PDMS), polyimide (PI) are used as substrates or packing materials; [12][13][14][15] ii) Taking advantage of deformable structures. In this aspect, it has been demonstrated that the rigid materials can be endowed with flexibility after they are transformed from bulk to thin films or fibers, or are configured into such structures where stretching can be altered to bending motions, for example, serpentine, wavy and rigid island structures. [16][17][18] To maximize the flexibility of EES devices, it is desired to combine the aforementioned two strategies by constructing the intrinsically flexible EES materials in deformable structures. To optimize the performance of a flexible electronic system, it is also desired to integrate the EES devices with other functional units in well-designed mechanical structures. This has brought a big challenge to the manufacturing of flexible electronics since traditional manufacturing methods are insufficient in the structure design.Modern printing methods, such as 3D printing, screen printing, and inkjet printing, which exhibit high-degree flexibility pattern writing, provide new opportunities for manufacturing flexible EES devices as well as other electronic devices. 3D printing, also known as additive manufacturing technology, enables fabricating of EES electrodes and solid electrolytes in well-designed 3D architectures by stacking functional materials layer by layer. [19][20][21][22] However, increasing the printing dimension raises challenges for device flexibility, resulting in critical limitations in material selection and complex material processing. [23] Moreover, the highcost of 3D printing instruments and big trade-off between printing speed and resolution make 3D printing difficult to be applied in the manufacturing of integrated flexible electronic devices. [24] Screen printing is an industrial printing technique that can form EES electrodes in pre-designed patterns on flexible substrates by dragging material inks across a screen with meshes. The typical thickness of screen-printed film is about 10 µm. [25][26][27] The screen printing process is

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Selective surface modification of PET substrate for inkjet printing

Cited by 17 publications

References 13 publications

Inkjet Printing Controllable Polydopamine Nanoparticle Line Array for Transparent and Flexible Touch‐Sensing Application

Inkjet Printing Controllable Polydopamine Nanoparticle Line Array for Transparent and Flexible Touch‐Sensing Application

Fabrication of anti-adhesion surfaces on aluminium substrates of rubber plastic moulds using electrolysis plasma treatment

Recent Developments of Inkjet‐Printed Flexible Energy Storage Devices

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