Selective metallization on copper aluminate composite via laser direct structuring technology

Yang, Jong uk; Cho, Jin Han; Yoo, Myong Jae

doi:10.1016/j.compositesb.2016.11.041

Cited by 62 publications

(43 citation statements)

References 14 publications

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“…The calculated mean crystal size is about 12.7–14.5 nm. In the previous research studies, metal oxides (Al 2 O 3 , CeO 2 , CuO, ZnO) or metal complex (Cu–Cr complex) were selected for LDS and electroless metal plating . In this study, metal complex consisting of tin oxide and mica was chosen to validate its feasibility and practicality in LDS process.…”

Section: Resultsmentioning

confidence: 99%

“…where K is the Scherrer constant and usually takes a value of about 0.89, λ is the wavelength of X-ray source used in XRD analysis, β is the half width of the observed diffraction peak, and θ is the Bragg angle of the observed diffraction line [26]. [2]. In this study, metal complex consisting of tin oxide and mica was chosen to validate its feasibility and practicality in LDS process.…”

Section: Characteristics Of Lds Additivementioning

confidence: 99%

“…LDS polymer composites are first prepared and injection molded. And then, the surface of molded part is activated and structured by laser irradiation, which allows selective chemical copper plating to form conductive patterns . In this technology, LDS additive is a crucial material, which needs to be activated and split into metal element and radical groups under laser beam irradiation .…”

Section: Introductionmentioning

confidence: 99%

“…Recently, studies were conducted for preparation of LDS additives [10], modification of polymer substrates [3], optimization of laser ablation parameters [11], electroless plating process [2], and so on. Liu et al [12] reported that synthesized copper chromite using sol-gel self-propagating combustion method was superior to high temperature solid phase method and alcohol-water coprecipitation method.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Glass Fiber Reinforced Polycarbonate Composites for Laser Direct Structuring and Electroless Copper Plating

Wang

et al. 2020

Polymer Engineering & Sci

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Glass fiber (GF) reinforced polycarbonate (PC) composites were prepared for laser direct structuring (LDS) applications. A small amount of styrene–maleic anhydride (SMA) was introduced to enhance GF/PC interfacial interactions. The PC/SMA/GF LDS composites using metal complex as LDS additive were investigated for applicability in copper circuit development. Rough surface patterns by laser irradiation under different laser parameters were measured by microscopy and Fourier infrared spectrometry. Copper particles and plating layer by subsequent electroless copper plating procedure was observed using microscopy. Thickness of plating layer and adhesion between layer and matrix were also evaluated. The results showed that laser repetition and scanning speed led to different resolutions and ablated surfaces without structural changes of composites. Copper particles gradually deposited, grew, and interconnected during metallization procedure. Plating layer was successfully formed at an optimum LDS additive loading, and appropriate scanning speed and repetition of laser. In addition, the plating layer displayed disparate thickness and distribution, owing to different activated surfaces by irradiation. Severe ablation or unetched parallel regions resulted in leaky or discontinuous plating layer. Better plating microstructure and higher adhesion were obtained for the composite material with 1.0 wt% LDS additive loading, supporting its extensive development and practical application in LDS technology. POLYM. ENG. SCI., 60:860–871, 2020. © 2020 Society of Plastics Engineers

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Section: Resultsmentioning

confidence: 99%

Section: Characteristics Of Lds Additivementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Glass Fiber Reinforced Polycarbonate Composites for Laser Direct Structuring and Electroless Copper Plating

Wang

et al. 2020

Polymer Engineering & Sci

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“…Compared to SLS, however, SLA is quite limited because it requires light-sensitive polymers and the thermomechanical properties of the obtained scaffolds still needs to be improved. Through SLS, many polymeric materials, such as polycarbonate 62 and polypropylene 63 can be prepared. One ideal polymeric material that has been widely utilized in tissue engineering is polyesters.…”

Section: Polymeric Materialsmentioning

confidence: 99%

<p>Nanoscale 3D Bioprinting for Osseous Tissue Manufacturing</p>

Wang

Gao

Wang

et al. 2020

IJN

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3D printing, as a driving force of innovation over many areas, brings numerous manufacturing methods together from the macro to nano scales. New revolutionary materials (such as polymeric materials and natural biomaterials) can be produced into unique 3D printed nanostructures. The morphology and functionality of various 3D printing methods as well in vitro and in vivo results of their use towards regenerating bone are discussed in this review. This review further focuses nano scale 3D bioprinting technology for bone tissue engineering, mainly including recent progress in research on technical materials and methods, typical applications, and crucial achievements; explaining the scientific and technical challenges for bone tissue fabrication; and describing micro-nano scale 3D printing application prospects, development directions, and trends for the future for this field to realize its full potential.

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Printed Electronics Going 3D – An Overview on Structural Electronics

Schranzhofer

2022

Inkjet Printing in Industry

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Selective metallization on copper aluminate composite via laser direct structuring technology

Cited by 62 publications

References 14 publications

Glass Fiber Reinforced Polycarbonate Composites for Laser Direct Structuring and Electroless Copper Plating

Glass Fiber Reinforced Polycarbonate Composites for Laser Direct Structuring and Electroless Copper Plating

<p>Nanoscale 3D Bioprinting for Osseous Tissue Manufacturing</p>

Printed Electronics Going 3D – An Overview on Structural Electronics

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