2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.279
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Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers

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Cited by 11 publications
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“…A substantial advantage would be printing metal on ceramic enabling power packaging which uses thin-printed metal with wire bonding capability [19].…”
Section: B Additive Manufacturingmentioning
confidence: 99%