Selective electroplating of copper lines on pre-patterned tantalum oxide thin films

El‐Sayed, Hany A.; Greiner, Mark; Kruse, Peter

doi:10.1016/j.apsusc.2007.05.014

Cited by 9 publications

(4 citation statements)

References 41 publications

(47 reference statements)

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“…The decrease in thickness with an increase in anodic potential has also been observed by He et al 19 for copper, but this is opposite to the general trend for metals. 20 The thickness of the anodic oxide on most metals typically increases with potential, for example, magnesium, 21 titanium, 14,20,22,23 tantalum, 24 aluminum, 23,25 and also copper. 26 The explanation for copper in 19 M NaOH is that at +3 V and higher, the copper dissolution rate exceeds the passive film growth rate, so there is no significant anodic oxide on the surface.…”

Section: Resultsmentioning

confidence: 99%

Transpassive Dissolution of Copper and Rapid Formation of Brilliant Colored Copper Oxide Films

Fredj

Burleigh

2011

J. Electrochem. Soc.

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This paper describes an electrochemical technique for growing adhesive copper oxide films on copper with attractive colors ranging from gold-brown to pearl with intermediate colors from red violet to gold green. The technique consists of anodically dissolving copper at transpassive potentials in hot sodium hydroxide, and then depositing brilliant color films of Cu 2 O onto the surface of copper after the anodic potential has been turned off. The color of the copper oxide film depends on the temperature, the anodic potential, the time t 1 of polarization, and the time t 2 , which is the time of immersion after potential has been turned off. (At potentials lower than the transpassive region, that is, in the passive region, the oxide film is a dark gray or dark green matte with a blue powder hydroxide on the surface and it is not attractive.) The brilliant colored films were characterized using glancing angle x-ray diffraction, and the film was found to be primarily Cu 2 O. Cyclic voltammetry, chronopotentiometry, scanning electron microscopy, and x-ray photoelectron spectroscopy were also used to characterize these films. These techniques show that the different colors were due to differences in porosity and thickness rather than changes in composition.

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Section: Resultsmentioning

confidence: 99%

Transpassive Dissolution of Copper and Rapid Formation of Brilliant Colored Copper Oxide Films

Fredj

Burleigh

2011

J. Electrochem. Soc.

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“…What makes tantalum oxide thin films especially interesting for nano-technology is their unique behaviour of being n-type semiconducting for thicknesses lower than 15 nm, and insulating for thicknesses beyond 15 nm. 9 Furthermore, tantalum oxide has been reported to remarkably enhance catalytic activity and selectivity and to prolong catalyst life when added in small amounts to known catalysts. [10][11][12][13][14][15][16] Tantalum oxide easily reacts with many other oxides to form mixed metal oxide phases with * Author to whom correspondence should be addressed.…”

Section: Introductionmentioning

confidence: 99%

Tailoring the Structural and Microstructural Properties of Nanosized Tantalum Oxide for High Temperature Electrochemical Gas Sensors

Bonavita¹,

Bartolomeo²,

Chevallier³

et al. 2009

J. Nanosci. Nanotech.

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Ta2O5 nanopowders to be used as sensing electrodes in high temperature electrochemical gas sensors for hydrocarbons detection were synthesized using a sol-gel method and their structural and microstructural properties were investigated. The as-synthesized powders were heated at different temperatures in the range 250-1000 degrees C and characterized by TG-DTA, XRD, SEM, TEM and FT-IR. This investigation allowed to identify the correct thermal treatments to achieve the microstructural, textural and functional stability of materials working at high temperature, preserving their nano-metric grain size. Planar sensors fabricated by using Ta2O5 powders treated at 750 degrees C showed promising results for the selective detection of propylene at high temperature (700 degrees C). The good stability of the sensing response after gas exposure at high temperature was correlated to the stable microstructure the electrodes. Thus, Ta2O5 powders seems good candidate as sensing electrode for sensors for automotive exhausts monitoring.

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“…This indicates the tunneling effect caused by an existing copper oxide layer [30]. It is well known that copper is an easily oxidized metal under ambient atmosphere conditions [31,32]. The resistivity of a 20 µm long copper line based on the metallic characteristic was calculated as follows:…”

Section: Resultsmentioning

confidence: 99%

Fabrication of uniform and high resolution copper nanowire using intermediate self-assembled monolayers through direct AFM lithography

et al. 2012

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Electrochemical AFM lithography was used to directly fabricate copper nanowires. The copper ions were strongly reduced by a negative sample bias at the point where the AFM tip was localized, and copper metal wires were successfully fabricated following the direction of the electrical field of the bias. A TDA⋅HCl self-assembled monolayer (SAM) was found to play an important role as an intermediate layer for enhancing the capability of high resolution and complete development after the AFM lithographic process. The physical and electrical properties of the wires were analyzed by AFM, EFM, SEM, TEM and I-V measurement. The fabricated copper has promising potential for applications such as masks and interconnectors for nanoelectronic devices.

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Selective electroplating of copper lines on pre-patterned tantalum oxide thin films

Cited by 9 publications

References 41 publications

Transpassive Dissolution of Copper and Rapid Formation of Brilliant Colored Copper Oxide Films

Transpassive Dissolution of Copper and Rapid Formation of Brilliant Colored Copper Oxide Films

Tailoring the Structural and Microstructural Properties of Nanosized Tantalum Oxide for High Temperature Electrochemical Gas Sensors

Fabrication of uniform and high resolution copper nanowire using intermediate self-assembled monolayers through direct AFM lithography

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