Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials 2003
DOI: 10.7567/ssdm.2003.d-10-4
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Selective Dry Etching of HfO2 in CF4, Cl2 and HBr Based Chemistry

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Cited by 2 publications
(3 citation statements)
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“…Suitable etching chemistries are: ‫݈ܥܤ‬ ଷ ‫݈ܥ/‬ ଶ /Ar for ‫݈ܣ‬ ଶ ܱ ଷ layers, which has an etching rate of about 100Å/min, HBr/Cl/Ar for Hafnium Oxide layers [9], and, BCl ଷ /Ar for Aluminium Nitride.…”
Section: Experimental Processing Detailsmentioning
confidence: 99%
“…Suitable etching chemistries are: ‫݈ܥܤ‬ ଷ ‫݈ܥ/‬ ଶ /Ar for ‫݈ܣ‬ ଶ ܱ ଷ layers, which has an etching rate of about 100Å/min, HBr/Cl/Ar for Hafnium Oxide layers [9], and, BCl ଷ /Ar for Aluminium Nitride.…”
Section: Experimental Processing Detailsmentioning
confidence: 99%
“…A wide variety of chemistries have been tried for the etching of high-k metal oxides such as HfO 2 and ZrO 2 . [4][5][6][7][8][9][10][11][12] These studies have revealed that etching of these materials is dominated by momentum transfer from the ions to the surface atoms in most cases. [7][8][9] An etch selectivity toward Si of 10 and higher has been reported.…”
Section: Introductionmentioning
confidence: 99%
“…[4][5][6][7][8][9][10][11][12] These studies have revealed that etching of these materials is dominated by momentum transfer from the ions to the surface atoms in most cases. [7][8][9] An etch selectivity toward Si of 10 and higher has been reported. 12,13 Furthermore, Sha et al 5 have reported that a functional transistor could be built with HfO 2 as a gate dielectric with the pattern transferring using a BCl 3 plasma.…”
Section: Introductionmentioning
confidence: 99%