“…As further scaling of silicon (Si) microelectronics reaches its fundamental limits, two-dimensional (2D) semiconductor materials have garnered considerable attention as post-Si channel layers owing to their excellent electrostatic control, dangling-bond-free smooth surface, and high carrier mobility . The 2D transition-metal dichalcogenide (TMD) semiconductors, including WSe 2 , WS 2 , MoS 2 , and MoTe 2 , have a thickness-dependent energy band gap with decent carrier mobility, which makes TMDs competitive over graphene as an ultrathin channel layer for next-generation high-performance nanoelectronic devices. − High-performance electronic (diodes and transistors) and optoelectronic (photodetectors and light-emitting diodes) devices based on TMD semiconductors have been demonstrated. − In particular, WSe 2 with band gap energy between 1.7 eV (direct, monolayer) and 1.2 eV (indirect, multilayer) is an intriguing semiconductor material, primarily because it has ambipolar transport properties (electron mobility ∼250 cm 2 /V·s and hole mobility ∼270 cm 2 /V·s) that have the potential to replace the existing silicon complementary metal-oxide semiconductor (CMOS) architecture which requires both enhancement-mode n-channel and p-channel transistors. , In ambipolar field-effect transistors (FETs), the major transport carriers can be reversibly and intentionally altered between electrons and holes by applying an electrostatic field. ,, Thus, it can function as p-channels or n-channels selectively. Accordingly, the existing CMOS fabrication process, which comprises multiple ion implantation and subsequent activation annealing processes, can be greatly simplified. , Consequently, the footprint of the CMOS device architectures can be scaled.…”