Selective area deposition of Tin–Nickel alloy coating – an alternative for decorative chromium plating

Subramanian, B.; Mohan, S.; Jayakrishnan, Sobha

doi:10.1007/s10800-006-9236-6

Cited by 22 publications

(13 citation statements)

References 8 publications

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“…This finding indicates continuous covering of copper with tin, even for the coatings of the least thickness (0.2 and 0.3 µm for SnHCl and SnMSA samples, respectively). Similar values of the E corr was reported for much thicker (electrodeposited) tin coatings in neutral solutions 23–28.…”

Section: Resultssupporting

confidence: 84%

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The corrosion characteristics and solderability of immersion tin coatings on copper

Araźna

Królikowski

Kozioł

et al. 2012

Materials & Corrosion

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Immersion tin is widely used as a lead free surface finish in the printed circuit board technology. Tin prevents the underlying copper from corrosion and preserves its solderability during a long storage and lead-free assembly processes. Investigated immersion tin coatings were deposited on copper foil from thiourea-type baths with hydrochloric acid addition (SnHCl coatings) or methanesulfonic acid addition (SnMSA coatings). Obtained coatings were investigated in the as deposited state and after aging (4 h at 155 8C, in air). The scanning electron microscopy studies revealed differences in structure of tin samples deposited from different baths. Results of polarization and impedance investigations indicated that as deposited SnHCl coatings had better corrosion resistance in 0.5 M NaCl solution than SnMSA coatings. The aging resulted in the improvement of the corrosion resistance of thinner coatings (0.2 and 0.5 mm thick SnHCl and 0.3 mm thick SnMSA), which were thoroughly converted into Sn-Cu intermetallic (IMC) phases. In contrary, thicker coatings exhibited some worsening of the corrosion resistance upon aging. The solderability of all as-deposited tin coatings was acceptable, but decreased after aging, especially for thinner coatings, showing the through conversion into Sn-Cu IMC phases.

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Section: Resultssupporting

confidence: 84%

“…Similar values of the corrosion current density for thick tin electrodeposits in NaCl solutions were reported in Refs. 23, 24, 35.…”

Section: Resultsmentioning

confidence: 99%

The corrosion characteristics and solderability of immersion tin coatings on copper

Araźna

Królikowski

Kozioł

et al. 2012

Materials & Corrosion

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“…If the duration of pulse is short, the diffusion layer does not have time to extend vary far into the solution and hence surface covered with denser build up of the fine grained deposits and this leads to lower porosity and higher hardness values. 19 The maximum hardness values were obtained at 80% duty cycle at high frequency.…”

Section: Effect Of Pulse Duty Cycle On Hardnessmentioning

confidence: 91%

“…These values indicate that the Sn coating has got better corrosion resistance than the mild steel. 19 …”

Section: Potentiodynamic Polarisation Studiesmentioning

confidence: 99%

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Pulse electrodeposition of tin from sulphate bath

Mohan¹,

Rajasekaran²

2009

Surface Engineering

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In the present work, the pulse electrodeposition of tin from sulphate bath containing SnSO 4 , H 2 SO 4 , phenol sulphonic acid, gelatin and ß-napthol has been studied. The influences of pulsed current, duty cycle on the thickness, hardness and current efficiency of the tin deposit were studied. Electrochemical corrosion studies of the deposited tin on mild steel were conducted by potentiodynamic polarisation and electrochemical impedance spectroscopy. Cyclic voltammetry studies using potential sweep of 10 mV s 21 provide information about the potential ranges for tin deposition and stripping. The tin deposit on a brass substrate has been investigated using XRD, SEM and AFM. The XRD analysis revealed that the tin plated is Sn(200) and crystalline. The morphology of tin deposit is a typical fine grained and granular structure as seen from SEM and AFM.

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Structure, microstructure and corrosion properties of brush-plated Cu–Ni alloy

Rajasekaran

Mohan

2009

J Appl Electrochem

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Cu-Ni alloy coatings on copper substrate by the brush-plating process have been investigated using XRD and AFM. The X-Ray diffraction analysis revealed that the brush-plated Cu-Ni alloy was heterogeneous and composed of cubic Cu 3.8 Ni phases. Uniform surface coverage of the substrate by granular morphology was observed from AFM. The corrosion protection performance of the brush-plated Cu-Ni alloy on copper substrate has been assessed using electrochemical corrosion tests. These results indicated a high charge transfer and low I corr for the alloy system compared with copper deposits and the copper substrate.

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Selective area deposition of Tin–Nickel alloy coating – an alternative for decorative chromium plating

Cited by 22 publications

References 8 publications

The corrosion characteristics and solderability of immersion tin coatings on copper

The corrosion characteristics and solderability of immersion tin coatings on copper

Pulse electrodeposition of tin from sulphate bath

Structure, microstructure and corrosion properties of brush-plated Cu–Ni alloy

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